| Project/Area Number |
25420748
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Composite materials/Surface and interface engineering
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| Research Institution | Osaka Municipal Technical Research Institute |
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Principal Investigator |
OHTSUKA Keiko 地方独立行政法人大阪市立工業研究所, 有機材料研究部, 研究主幹 (50416286)
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| Co-Investigator(Kenkyū-buntansha) |
木村 肇 地方独立行政法人大阪市立工業研究所, 有機材料研究部, 研究主任 (60416287)
松本 明博 地方独立行政法人大阪市立工業研究所, 企画部, 部長 (40416285)
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| Project Period (FY) |
2013-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2015: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2014: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2013: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
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| Keywords | ネットワークポリマー / 熱硬化性樹脂 / ビスマレイミド樹脂 / 高耐熱性 / 低熱膨張性 / 強靭性 / アリル化合物 / アミン / エポキシ樹脂 / マレイミド / 靱性 |
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| Outline of Final Research Achievements |
Bismaleimide resin, which is expected as a next-generation semiconductor power device packaging material, has high heat resistance and low thermal expansion, but it has a disadvantage of being hard and brittle. In this study, the relationship between primary structure, compounding condition, curing condition and heat resistance, thermal expansion property, toughness of a polymer alloy based on bismaleimide resin was clarified. Based on the obtained knowledge, a polymer alloy based on bismaleimide resin having a lowest thermal expansion property, toughness and high heat resistance at a maximum curing temperature of 200℃ was found. In addition, it was shown that a polymer alloy based on bismaleimide resin modified with a polythiol having thiol group reacting with maleimide group and allyl group, and long chain aliphatic unit in the side chain showed excellent low thermal expansion property, toughness and high heat resistance.
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