| Project/Area Number |
25630029
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kumamoto University |
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Principal Investigator |
KUBOTA Akihisa 熊本大学, 自然科学研究科, 准教授 (80404325)
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| Project Period (FY) |
2013-04-01 – 2015-03-31
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| Project Status |
Completed (Fiscal Year 2014)
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| Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2014: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2013: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | ダイヤモンド / 精密研磨 / 紫外光援用研磨 / 先端機能デバイス / 精密部品加工 |
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| Outline of Final Research Achievements |
Diamond substrate has excellent physical properties, attracts attention as a material for the next-generation semiconductor devices. However, diamond substrate is hard to machine because it possess the high-hardness and high chemical inertness. Processing techniques of high removal efficiency and damage-free surface are required in recent years. In this study, we have proposed a novel polishing technique combined with ultraviolet (UV) irradiation utilizing a metal-oxide plate. In this study, while clarifying the processing characteristics of the diamond by the proposed method, we have found the possibility of precision polishing of diamond substrate with high efficiency and high precision at the same time.
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