| Project/Area Number |
25709005
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| Research Category |
Grant-in-Aid for Young Scientists (A)
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| Allocation Type | Partial Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Ibaraki University |
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Principal Investigator |
Onuki Teppei 茨城大学, 工学部, 准教授 (70400447)
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| Research Collaborator |
Zhou Libo 茨城大学, 工学部, 教授 (90235705)
Shimizu Jun 茨城大学, 工学部, 教授 (40292479)
Ojima Hirotaka 茨城大学, 工学部, 准教授 (90375361)
Yamamoto Takeyuki 茨城大学, 工学部, 技術職員 (40396594)
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| Project Period (FY) |
2013-04-01 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥21,970,000 (Direct Cost: ¥16,900,000、Indirect Cost: ¥5,070,000)
Fiscal Year 2015: ¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2014: ¥7,670,000 (Direct Cost: ¥5,900,000、Indirect Cost: ¥1,770,000)
Fiscal Year 2013: ¥9,750,000 (Direct Cost: ¥7,500,000、Indirect Cost: ¥2,250,000)
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| Keywords | ウェハ薄片化 / 厚さ計測 / 画像計測 / 干渉計 / 分光 / 半導体ウエハ / 干渉 / 測定精度 / 分光イメージング / 表面性状 / 近赤外分光 / 低コヒーレント干渉 / 白色光反射分光計測 / 極薄ウェハ / シリコンウェハ / 研削加工 |
|---|
| Outline of Final Research Achievements |
Optical thickness measurement technologies for next generation of wafer thinning process are developed, for (1)optimized measurement range (whole range from initial to destination thickness), high precision (evaluations of tolerance and thickness variation within 0.1 micron order precision), precision assurance (calibration techniques and analysis of error characteristics), (2)wide area imaging thickness measurement techniques, and (3) on-machine and in-process measurements for process control.
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