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Single-step fabrication of untra narrow through silicon via for 3-dimensional integration of electronic devices

Research Project

Project/Area Number 25709075
Research Category

Grant-in-Aid for Young Scientists (A)

Allocation TypePartial Multi-year Fund
Research Field Reaction engineering/Process system
Research InstitutionThe University of Tokyo

Principal Investigator

Momose Takeshi  東京大学, 工学(系)研究科(研究院), 講師 (10611163)

Project Period (FY) 2013-04-01 – 2016-03-31
Project Status Completed (Fiscal Year 2015)
Budget Amount *help
¥25,350,000 (Direct Cost: ¥19,500,000、Indirect Cost: ¥5,850,000)
Fiscal Year 2015: ¥4,940,000 (Direct Cost: ¥3,800,000、Indirect Cost: ¥1,140,000)
Fiscal Year 2014: ¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2013: ¥16,250,000 (Direct Cost: ¥12,500,000、Indirect Cost: ¥3,750,000)
Keywords超臨界流体 / 製膜 / 3次元実装 / Cu / 超臨界
Outline of Final Research Achievements

To fabricate through silicon via (TSV) into ultra narrow and high-aspect-ratio features, supercritical fluid deposition (SCFD), which utilizes chemical reactions in supercritical fluid, was studied. Deposition of metal films on insulative surface and improvement of filling capability are the issues, and were solved by development of composition-modulated CuMnOx buffer layer that was enabled by newly developed continuous reactor and optimization of the deposition conditions to maximize filling capability based on the solubility of source precursors in supercritical fluid. We eventually succeeded to fill Cu into silicon trench structure with aspect ratio exceeding 100.

Report

(4 results)
  • 2015 Annual Research Report   Final Research Report ( PDF )
  • 2014 Annual Research Report
  • 2013 Annual Research Report
  • Research Products

    (4 results)

All 2015 2014 2013

All Journal Article (1 results) (of which Peer Reviewed: 1 results) Presentation (3 results) (of which Int'l Joint Research: 1 results,  Invited: 1 results)

  • [Journal Article] Solubility of bis-(2,2,6,6-tetramethyl-3,5-heptanedionato)copper(II) in mixed supercritical CO2 and H2 systems for application in supercritical fluid deposition of Cu2015

    • Author(s)
      Takeshi Momose, Aiko Kondo, Tatsuya Kamiya, Hideo Yamada, Junji Ohara, Yasuhiro Kitamura, Hirohisa Uchida, Yukihiro Shimogaki, and Masakazu Sugiyama
    • Journal Title

      Journal of Supercritical Fluids

      Volume: 未定 Pages: 193-200

    • DOI

      10.1016/j.supflu.2015.04.002

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Presentation] Supercritical fluid deposition of metals and metal oxides for electronic device applications2015

    • Author(s)
      Takeshi Momose
    • Organizer
      The 7th China-Japan Symposium on Chemical Engineering
    • Place of Presentation
      Beijing, China
    • Year and Date
      2015-10-16
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Solubility measurement and correlation of Cu(tmhd)2 and Mn(pmcp)2 in mixture of scCO2 + H2 for supercritical fluid deposition2014

    • Author(s)
      Takeshi Momose, Aiko Kondo, Tatsuya Kamiya, Hideo Yamada, Junji Ohara, Yasuhiro Kitamura, Hirohisa Uchida, Yukihiro Shimogaki, and Masakazu Sugiyama
    • Organizer
      14th Euro Meeting on Supercritical Fluids
    • Place of Presentation
      Marseille, France
    • Year and Date
      2014-05-18 – 2014-05-21
    • Related Report
      2014 Annual Research Report
  • [Presentation] Solubility measurement of Cu(tmhd)2 and Mn(pmcp)2 in supercritical CO2/H2 mixture for supercritical fluid deposition2013

    • Author(s)
      Takeshi Momose, Aiko Kondo, Hideo Yamada, Junji Ohara, Yasuhiro, Kitamura, Hirohisa Uchida, Yukihiro Shimogaki, and Masakazu Sugiyama
    • Organizer
      9th World Congress of Chemical Engineering (WCCE9)
    • Place of Presentation
      Soul, Korea
    • Related Report
      2013 Annual Research Report

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Published: 2013-05-21   Modified: 2019-07-29  

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