Development of stretchable and flexible thermoelectric conversion module by printing method
Project/Area Number |
25810140
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Research Category |
Grant-in-Aid for Young Scientists (B)
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Allocation Type | Multi-year Fund |
Research Field |
Device related chemistry
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Research Institution | Osaka University |
Principal Investigator |
SUGAHARA Tohru 大阪大学, 産業科学研究所, 助教 (20622038)
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Project Period (FY) |
2013-04-01 – 2015-03-31
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Project Status |
Completed (Fiscal Year 2014)
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Budget Amount *help |
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2014: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2013: ¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
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Keywords | 熱電発電 / 実装材料 / 熱電変換 / プリンテッド・エレクトロニクス / 導電性接着剤 / 印刷法 |
Outline of Final Research Achievements |
We have developed flexible TEG modules for applying to heat sources with the curved surface such as exhaust pipes using ICA packaging technology. The module concept is that a mass of small Bi-Te thermoelectric chips are tightly mounted on a thin film substrate and connected with flexible and stretchable ICAs by printing technique. Fabricated TEG modules with 250 p-n pairs of thermoelectric chips have been evaluated in detail.
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Report
(3 results)
Research Products
(19 results)
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[Presentation] Rapid photo-sintering techniques for printing devices2014
Author(s)
Jinting Jiu, Manjeet Singh, Teppei Araki, Tohru Sugahara, Masaya Nogi, Hirotaka Koga, Shijo Nagao, Katsuaki Suganuma, Hiroshi Uchida
Organizer
5th International Conference on Flexible and Printed Electronics (ICFPE 2014)
Place of Presentation
Beijing, China
Year and Date
2014-10-21 – 2014-10-23
Related Report
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