| Project/Area Number |
25820007
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Nagoya Institute of Technology |
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Principal Investigator |
SHISHIDO Nobuyuki 名古屋工業大学, 工学(系)研究科(研究院), 研究員 (00570235)
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| Project Period (FY) |
2013-04-01 – 2015-03-31
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| Project Status |
Completed (Fiscal Year 2014)
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| Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2014: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
Fiscal Year 2013: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
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| Keywords | 界面強度 / 微視組織 / 塑性変形 / 局所変形 / 材料微視構造 / 結晶塑性 / ナノ・マイクロシステム |
|---|
| Outline of Final Research Achievements |
Copper interconnect systems of semiconductor devices has a risk of mechanical fracture along with the trend of further integration and miniaturization, because of many weak interfaces stacked to compose multilayered copper/dielectric systems. In order to improve mechanical reliability of the semiconductor products, those interface strengths were evaluated. In the case of polycrystalline copper structure, the evaluated strength of copper/SiN interface distributed with larger scatter than single crystalline copper structure. This result suggests that the microstructure of copper plays an important role on local interface strength. In addition, in-situ crystal orientation observation during the fracture test was performed. The obtained result demonstrated that the interface fracture accompanied the local plastic deformation of copper near the Cu/SiN interface depending on the microstructure.
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