Evaluation for distribution of interface strength induced by grain structure
Project/Area Number |
25820007
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Research Category |
Grant-in-Aid for Young Scientists (B)
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Allocation Type | Multi-year Fund |
Research Field |
Materials/Mechanics of materials
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Research Institution | Nagoya Institute of Technology |
Principal Investigator |
SHISHIDO Nobuyuki 名古屋工業大学, 工学(系)研究科(研究院), 研究員 (00570235)
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Project Period (FY) |
2013-04-01 – 2015-03-31
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Project Status |
Completed (Fiscal Year 2014)
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Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2014: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
Fiscal Year 2013: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
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Keywords | 界面強度 / 微視組織 / 塑性変形 / 局所変形 / 材料微視構造 / 結晶塑性 / ナノ・マイクロシステム |
Outline of Final Research Achievements |
Copper interconnect systems of semiconductor devices has a risk of mechanical fracture along with the trend of further integration and miniaturization, because of many weak interfaces stacked to compose multilayered copper/dielectric systems. In order to improve mechanical reliability of the semiconductor products, those interface strengths were evaluated. In the case of polycrystalline copper structure, the evaluated strength of copper/SiN interface distributed with larger scatter than single crystalline copper structure. This result suggests that the microstructure of copper plays an important role on local interface strength. In addition, in-situ crystal orientation observation during the fracture test was performed. The obtained result demonstrated that the interface fracture accompanied the local plastic deformation of copper near the Cu/SiN interface depending on the microstructure.
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Report
(3 results)
Research Products
(6 results)
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[Presentation] Grain structure effect on the stochastic distribution of local adhesion strength at metal/dielectric layer interface in copper wiring systems2014
Author(s)
Nobuyuki Shishido, Chuantong Chen, Shoji Kamiya, Kozo Koiwa, Masaki Omiya, Hisashi Sato, Masahiro Nishida, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo, Toshiaki Suzuki
Organizer
International Conference on Metallurgical Coatings and Thin Films
Place of Presentation
San Diego, CA
Year and Date
2014-04-28 – 2014-05-02
Related Report
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[Presentation] The effect of plastic anisotropy on evaluation Cu/SiN interface strength with different copper crystal orientation2014
Author(s)
Chuantong Chen, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Masaki Omiya, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Takeshi Nokuo, Toshiaki Suzuki
Organizer
Materials for Advanced Metallization 2014 (MAM2014)
Place of Presentation
Chemnitz, Germany
Related Report
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