| Project/Area Number |
25820030
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Design engineering/Machine functional elements/Tribology
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| Research Institution | Tohoku University |
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Principal Investigator |
SHIMIZU Yuki 東北大学, 工学(系)研究科(研究院), 准教授 (70606384)
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| Project Period (FY) |
2013-04-01 – 2015-03-31
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| Project Status |
Completed (Fiscal Year 2014)
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| Budget Amount *help |
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2014: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2013: ¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000)
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| Keywords | 欠陥検出 / 摩擦熱 / 熱検知素子 / 精密計測 / 計測 / 欠陥検査 / 接触センサ |
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| Outline of Final Research Achievements |
To realize precision defect detection required for next-generation semiconductor or LED wafers having nanometric-smooth surfaces, a new defect detection method utilizing a heat balance in-between a nanometric gap has been proposed. Fabrication process for the contact-type thermal sensor was established, and μm-sized prototype sensors were successfully fabricated. Experimental results revealed that the fabricated sensor could detect a contact with an object having a tip radius of 40 nm in such a way that the thermal sensor detected its temperature change due to the frictional heat as a deviation of its electric resistance. Furthermore, it was also found in the experiments that a large temperature gradient between the thermal sensor and the measurement surface had a possibility of detecting the approach of the thermal sensor to the surface defect regardless of the frictional heat.
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