| Project/Area Number |
25820122
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Electronic materials/Electric materials
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| Research Institution | University of Yamanashi |
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Principal Investigator |
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| Project Period (FY) |
2013-04-01 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2015: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2014: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2013: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
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| Keywords | 超臨界流体 / 薄膜 / 銅 / 凝集 / 拡散 / 銅薄膜 / 密着性 / 原子拡散 |
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| Outline of Final Research Achievements |
This study deals with Cu agglomeration and diffusion that occur in Cu thin films during annealing in supercritical CO2 fluid. Cu was deposited by using direct current magnetron sputtering on trench-patterned substrates. Annealing was performed in different atmospheres, namely, pure CO2, CO2 mixed with H2, CO2 mixed with hexafluoroacetylacetone (Hhfac), and CO2 mixed with H2 and Hhfac. The conspicuous agglomeration of Cu films was observed after annealing in the H2-mixed supercritical CO2 fluid. This is because Cu diffusion is accelerated by reduction and oxidation that proceed simultaneously on the Cu surface. In addition, Cu agglomeration during supercritical CO2 annealing can be prevented by using a suitable interlayer between Cu films and glass substrate.
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