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The effect of dynamic-local deformation on transistor characteristics by operation heating in 3D-IC

Research Project

Project/Area Number 25820133
Research Category

Grant-in-Aid for Young Scientists (B)

Allocation TypeMulti-year Fund
Research Field Electron device/Electronic equipment
Research InstitutionTohoku University

Principal Investigator

KINO Hisashi  東北大学, 学際科学フロンティア研究所, 助教 (10633406)

Project Period (FY) 2013-04-01 – 2015-03-31
Project Status Completed (Fiscal Year 2014)
Budget Amount *help
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2014: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2013: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
Keywords3D IC / 金属マイクロバンプ / アンダーフィル / 信頼性 / 曲げ応力 / 集積エレクトロニクス / 高密度実装 / プロセス技術・微細加工 / 半導体材料・デバイス
Outline of Final Research Achievements

A three-dimensional (3-D) IC has many lots of through-Si vias (TSVs) and metal microbumps to achieve electrical connections between stacked thinned LSI chips, and also has organic adhesives to obtain completely bonded thinned IC chips. However, these elements, especially microbumps and organic adhesives, induce static and dynamic local bending of the thinned IC chips. In this study, for the first time, we investigated impacts of the static and dynamic local bending on MOSFET characteristics using a novel test structure.
We demonstrated that the static local bending changed the carrier mobility accordingly with the position between the Si microbump and MOSFET using a novel test structure. We also demonstrated that the dynamic local bending changed the MOSFET performance. These results show that it is necessary to carefully design the layout of microbumps and MOSFETs in order to realize higher performance 3-D IC with suppressing circuit performance fluctuation due to local bending stress.

Report

(3 results)
  • 2014 Annual Research Report   Final Research Report ( PDF )
  • 2013 Research-status Report
  • Research Products

    (10 results)

All 2015 2014 2013 Other

All Journal Article (1 results) (of which Peer Reviewed: 1 results) Presentation (7 results) Remarks (2 results)

  • [Journal Article] Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice2014

    • Author(s)
      Mariappan Murugesan,Yasuhiko Imai,Shigeru Kimura, Takafumi Fukushima, Ji Cheol Bea,Hisashi Kino, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
    • Journal Title

      IEEE TRANSACTIONS ON ELECTRON DEVICES

      Volume: 61 Issue: 2 Pages: 540-546

    • DOI

      10.1109/ted.2013.2295463

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed
  • [Presentation] 三次元集積化における異種材料間の熱膨張係数差がおよぼす影響2015

    • Author(s)
      木野 久志、池ヶ谷 俊介、小柳 光正、田中 徹
    • Organizer
      第62回応用物理学会春季学術講演会
    • Place of Presentation
      神奈川
    • Year and Date
      2015-03-11 – 2015-03-14
    • Related Report
      2014 Annual Research Report
  • [Presentation] 3D IC用ビアラスト・バックサイドビアプロセスにおけるプラズマダメージのMOSFET特性への影響評価2014

    • Author(s)
      菅原陽平,橋口日出登,谷川星野,木野久志,福島誉史,李康旭,小柳光正,田中徹
    • Organizer
      第75回応用物理学会秋季学術講演会
    • Place of Presentation
      北海道
    • Year and Date
      2014-09-17 – 2014-09-20
    • Related Report
      2014 Annual Research Report
  • [Presentation] Investigation of the Plasma Damage by Etching Process for TSV Formation in Via-last Backside-via 3D IC2014

    • Author(s)
      Yohei Sugawara1, Hideto Hashiguchi, Seiya Tanikawa, Hisashi Kino, Kang-Wook Lee, Takafumi Fukusima, Mitsumasa Koyanagi, and Tetsu Tsnaka
    • Organizer
      International Conference on Solid State Devices and Materials
    • Place of Presentation
      Tsukuba, Japan
    • Year and Date
      2014-09-08 – 2014-09-11
    • Related Report
      2014 Annual Research Report
  • [Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive2014

    • Author(s)
      H.Kino, H.Hashiguchi, Y.Sugawara, S.Tanikawa, T.Fukushima, K-W.Lee, M.Koyanagi, and T.Tanaka
    • Organizer
      The 64th Electronic Components and Technology Conference
    • Place of Presentation
      Florida, USA
    • Year and Date
      2014-05-27 – 2014-05-30
    • Related Report
      2014 Annual Research Report
  • [Presentation] Minimization of Keep-Out-Zone (KOZ) in 3D IC by Local Bending Stress Suppression with Low Temperature Curing Adhesive,2014

    • Author(s)
      H. Kino, H. Hashiguchi, Y. Sugawara, S. Tanikawa, T. Fukusima, K.-W. Lee, M. Koyanagi, and T. Tanaka
    • Organizer
      64th Electronic Components and Technology Conference 2014
    • Place of Presentation
      Florida, USA
    • Related Report
      2013 Research-status Report
  • [Presentation] Local Bending Stress Reduction with Room-Temperature Curing Adhesive for Decrease in Keep-out-Zone (KOZ) of 3D IC2013

    • Author(s)
      H. Kino, T. Fukusima, K.-W. Lee, M. Koyanagi, and T. Tanaka
    • Organizer
      2013 International Conference on Solid State Materials and Devices
    • Place of Presentation
      Hilton Fukuoka Sea Hawk, Fukuoka
    • Related Report
      2013 Research-status Report
  • [Presentation] 室温硬化型樹脂による3DIC内の機械応力低減に関する検討2013

    • Author(s)
      木野 久志, 福島 誉史, 小柳 光正, 田中 徹
    • Organizer
      2013秋季第74 回応用物理学会秋季学術講演会
    • Place of Presentation
      同志社大学京田辺キャンパス
    • Related Report
      2013 Research-status Report
  • [Remarks] 東北大学大学院医工学研究科 田中(徹)研究室ホームページ

    • URL

      http://www.lbc.mech.tohoku.ac.jp

    • Related Report
      2014 Annual Research Report
  • [Remarks] 東北大学大学院医工学研究科 田中(徹)研究室

    • URL

      http://www.lbc.mech.tohoku.ac.jp/

    • Related Report
      2013 Research-status Report

URL: 

Published: 2014-07-25   Modified: 2019-07-29  

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