Development of defect-controlled hetero-junction contact with amorphous silicon insertion
Project/Area Number |
25870466
|
Research Category |
Grant-in-Aid for Young Scientists (B)
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Allocation Type | Multi-year Fund |
Research Field |
Thin film/Surface and interfacial physical properties
Electronic materials/Electric materials
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Research Institution | Hiroshima University |
Principal Investigator |
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Project Period (FY) |
2013-04-01 – 2015-03-31
|
Project Status |
Completed (Fiscal Year 2014)
|
Budget Amount *help |
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2014: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2013: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
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Keywords | 炭化ケイ素 / オーミックコンタクト / シリコン挿入層 / ワイドバンドギャップ半導体 / Si/SiCヘテロ接合 |
Outline of Final Research Achievements |
Low-resistivity contact formation by band potential control with a high-impurity contained amorphous Si insertion layer was investigated for Silicon carbide (SiC) devices. Using a proposed method, effective contact property of 2x10-6Ωcm2 was achieved without annealing process of metal electrode. XPS measurement revealed that defect controlled a-Si insertion layer reduces potential energy offset. From these results, band offset alignment was controlled by proposed defect-controlled a-Si layer insertion. These results expected to increase SiC device reliability and properties.
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Report
(3 results)
Research Products
(6 results)