階層的破壊誘導機構に基づく強靭かつ分離・再接合可能な異種材料接合体の創製

• Project/Area Number: 25K01546
• Research Category: Grant-in-Aid for Scientific Research (B)
• Allocation Type: Multi-year Fund
• Section: 一般
• Review Section: Basic Section 26050:Material processing and microstructure control-related
• Research Institution: The University of Osaka
• Principal Investigator: 松田 朋己 大阪大学, 大学院工学研究科, 助教 (30756333)
• Project Period (FY): 2025-04-01 – 2028-03-31
• Project Status: Adopted (Fiscal Year 2025)
• Budget Amount: ¥18,850,000 (Direct Cost: ¥14,500,000、Indirect Cost: ¥4,350,000); Fiscal Year 2027: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000); Fiscal Year 2026: ¥7,930,000 (Direct Cost: ¥6,100,000、Indirect Cost: ¥1,830,000); Fiscal Year 2025: ¥7,150,000 (Direct Cost: ¥5,500,000、Indirect Cost: ¥1,650,000)