| Project/Area Number |
26249001
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| Research Category |
Grant-in-Aid for Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Nagoya University |
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Principal Investigator |
Ju Yang 名古屋大学, 工学研究科, 教授 (60312609)
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| Co-Investigator(Kenkyū-buntansha) |
細井 厚志 早稲田大学, 理工学術院, 准教授 (60424800)
森田 康之 名古屋大学, 工学(系)研究科(研究院), 准教授 (90380534)
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| Co-Investigator(Renkei-kenkyūsha) |
MURAOKA Mikio 秋田大学, 大学院工学研究科, 教授 (50190872)
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| Project Period (FY) |
2014-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥36,270,000 (Direct Cost: ¥27,900,000、Indirect Cost: ¥8,370,000)
Fiscal Year 2016: ¥11,050,000 (Direct Cost: ¥8,500,000、Indirect Cost: ¥2,550,000)
Fiscal Year 2015: ¥11,310,000 (Direct Cost: ¥8,700,000、Indirect Cost: ¥2,610,000)
Fiscal Year 2014: ¥13,910,000 (Direct Cost: ¥10,700,000、Indirect Cost: ¥3,210,000)
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| Keywords | ナノ材料 / マイクロ・ナノデバイス / ナノワイヤ配列 / 面ファスナー / 常温実装 |
|---|
| Outline of Final Research Achievements |
This research is to develop, ahead of the rest of the world, next-generation electronics packaging technology that will make it possible to use electronic packages in high-temperature environments and to connect them to flexible substrates. This has been achieved by developing an electrically conductive nanowire surface fastener (ECNSF) that, through self-organization, organically combines the multiple-channel electron transport function of patterned three-dimensional metallic nanowire arrays with the bonding function between nanowires. Furthermore, this research has also been succeeded with creating, for the first time in the world, innovative cold-temperature packaging technology that is not an extension of conventional technologies by clarifying the multiple-channel electron transport mechanism of metallic nanowires, the van der Waals force that acts between nanowires, and the mechanical phenomena of the hook and loop structures of nanowires.
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