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Low Temperature and Non-Vacuum Bonding of Wide Bandgap Semiconductor Materials by VUV/Vapor-Assisted Method

Research Project

Project/Area Number 26289112
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypePartial Multi-year Fund
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionNational Institute for Materials Science

Principal Investigator

Shigetou Akitsu  国立研究開発法人物質・材料研究機構, 構造材料研究拠点, 主幹研究員 (70469758)

Co-Investigator(Kenkyū-buntansha) 水野 潤  早稲田大学, ナノ理工学研究機構, 上級研究員(研究院教授) (60386737)
Project Period (FY) 2014-04-01 – 2018-03-31
Project Status Completed (Fiscal Year 2017)
Budget Amount *help
¥16,380,000 (Direct Cost: ¥12,600,000、Indirect Cost: ¥3,780,000)
Fiscal Year 2016: ¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
Fiscal Year 2015: ¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2014: ¥8,580,000 (Direct Cost: ¥6,600,000、Indirect Cost: ¥1,980,000)
Keywords低温大気圧接合 / ワイドバンドギャップ半導体 / VUV / 接合 / 低温大気圧 / GaN / Si / SiC / PDMS / パワーエレクトロニクス / MEMS / ハイブリッド接合 / 真空紫外光 / 実装 / 電子デバイス・機器 / 複合材料・物性 / 表面・界面物性 / 低温 / 大気圧 / 表面 / 界面 / 複合材料 / 表面・界面
Outline of Final Research Achievements

A novel low temperature hybrid bonding process was developed for GaN, SiC, and Si, including other substrate materials such as PDMS, polyimide, and wiring metals. This process utilized the vacuum ultraviolet (VUV) in nitrogen atmosphere, where the compatible chemical bridging component like water vapor was introduced, therefore the vacuum atmosphere was able to be eliminated. The VUV irradiation in humidified nitrogen generated the radical species of H and OH, then enabled the cleaning of outmost surface, deoxidization of native oxide, and the creation of ultrathin hydrate bridges in single process. Upon heating at 150 C after the touchdown, dehydration condensation in the bridge layers resulted in strong adhesion regardless of the combination of materials. The interfacial structure and property was found robust after the aging test due to sufficient interdiffusion via ultrathin bridge layers. Moreover, a simple LED structure could be fabricated by this VUV/vapor-assisted method.

Report

(5 results)
  • 2017 Annual Research Report   Final Research Report ( PDF )
  • 2016 Annual Research Report
  • 2015 Annual Research Report
  • 2014 Annual Research Report
  • Research Products

    (42 results)

All 2017 2016 2015 2014 Other

All Int'l Joint Research (2 results) Journal Article (11 results) (of which Int'l Joint Research: 2 results,  Peer Reviewed: 11 results,  Open Access: 6 results,  Acknowledgement Compliant: 6 results) Presentation (28 results) (of which Int'l Joint Research: 11 results,  Invited: 17 results) Book (1 results)

  • [Int'l Joint Research] 国立台湾大学(台湾)

    • Related Report
      2017 Annual Research Report
  • [Int'l Joint Research] 国立台湾大学(国立台湾大学-NIMS連携大学院)(台湾)

    • Related Report
      2016 Annual Research Report
  • [Journal Article] Low temperature direct bonding between PEEK and Pt via vapor-assisted vacuum ultraviolet surface modificatrion2017

    • Author(s)
      Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno
    • Journal Title

      MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS

      Volume: 7 Issue: 2 Pages: 49-62

    • DOI

      10.17265/2161-6221/2017.3-4.001

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed / Open Access
  • [Journal Article] 次世代パワー半導体用接合技術の動向2017

    • Author(s)
      並木尚己 重藤暁津
    • Journal Title

      YANO E Plus

      Volume: 118 Pages: 73-76

    • Related Report
      2017 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Evolution of Surface Chemical Structure Induced by Ar Fast Atom Beam (Ar-FAB) Bombardment and Vacuum Ultraviolet (VUV) Irradiation for Low Temperature Hybrid Bonding2017

    • Author(s)
      H.W. Yang, C.R. Kao, and A. Shigetou
    • Journal Title

      Electronics Materials

      Volume: 印刷中

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] Low-temperature direct heterogeneous bonding of polyether ether ketone and platinum2017

    • Author(s)
      W. Fu, J. Mizuno, S. Shoji, and A. Shigetou
    • Journal Title

      Materials Science & Engineering C

      Volume: 印刷中

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection2016

    • Author(s)
      M. Ohyama、M. Nimura、J. Mizuno、S. Shoji、T. Nonaka、Y. Shinba、A. Shigetou
    • Journal Title

      Microelectronics Reliability

      Volume: 59 Pages: 134-139

    • DOI

      10.1016/j.microrel.2015.12.033

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed / Open Access / Int'l Joint Research
  • [Journal Article] Hybrid Bonding Technology at Low Temperature and Atmospheric Pressure for Multi-Field Applications2016

    • Author(s)
      重藤暁津 梶原優介
    • Journal Title

      Journal of The Japan Institute of Electronics Packaging

      Volume: 19 Issue: 2 Pages: 120-126

    • DOI

      10.5104/jiep.19.120

    • NAID

      130005155004

    • ISSN
      1343-9677, 1884-121X
    • Related Report
      2016 Annual Research Report 2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] 低温大気圧による有機無機材料ハイブリッド化2016

    • Author(s)
      重藤暁津
    • Journal Title

      ケミカルエンジニアリング

      Volume: 61 Pages: 287-293

    • Related Report
      2016 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of hybrid bonding technology of single0micron pitch with planar structure for 3D interconnection2016

    • Author(s)
      M. Ohyama, M. Nimura, J. Mizuno, S. Shoji, T. Nonaka, and A. Shigetou
    • Journal Title

      IEEE Journal of Microelectronics Reliability

      Volume: 59 Pages: 134-139

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Acknowledgement Compliant
  • [Journal Article] 低温大気圧接合による有機無機材料ハイブリッド化2016

    • Author(s)
      重藤 暁津
    • Journal Title

      ケミカルエンジニヤリング

      Volume: 61 Pages: 287-293

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Hybrid Bonding Technology with Planar Structure for 3D Interconnection of Microbump with Single-Micron Pitch2015

    • Author(s)
      Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, and Akitsu Shigetou
    • Journal Title

      Microelectronics Reliability

      Volume: 印刷中

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI2014

    • Author(s)
      M. Nimura, J. Mizuno, S. Shoji, K. Sakuma, H. Ogino, T. Enomoto, A, Shigetou
    • Journal Title

      IEEE Transactions on Components, Packaging and Manufacturing Technology

      Volume: Vol.4 Issue: 5 Pages: 762-768

    • DOI

      10.1109/tcpmt.2014.2311094

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Presentation] A New Hybrid Bonding Method for 3D Integration2017

    • Author(s)
      Akitsu Shigetou
    • Organizer
      日仏三次元集積回路の課題と今後の展開に関するワークショップ
    • Related Report
      2017 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] A new hybrid bonding for 3D integration2017

    • Author(s)
      A. Shigetou
    • Organizer
      日仏工業会 第2回日仏三次元集積回路の課題と今後の展開に関するワークショップ
    • Place of Presentation
      日仏会館,東京
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Non-vacuum low temperature hybrid bonding for lightweight and flexible electronics2016

    • Author(s)
      A. Shigetou
    • Organizer
      IEEE CPMT IMPACT 2016
    • Place of Presentation
      南岸国際展示場,台湾
    • Year and Date
      2016-10-26
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Low temperature direct bonding of polyether ether ketone (PEEK) and Pt2016

    • Author(s)
      W. Fu, A. Shigetou, S. Shoji, and J. Mizuno
    • Organizer
      IEEE CPMT IMPACT 2016
    • Place of Presentation
      南岸国際展示場,台湾
    • Year and Date
      2016-10-26
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 生体親和性エレクトロニクス実装のための低温大気圧接合技術2016

    • Author(s)
      重藤暁津,水野潤,庄子習一
    • Organizer
      JIEP マイクロエレクトロニクスシンポジウム(MES)
    • Place of Presentation
      中京大学,名古屋
    • Year and Date
      2016-09-08
    • Related Report
      2016 Annual Research Report
    • Invited
  • [Presentation] Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification2016

    • Author(s)
      W. Fu, A. Shigetou, S. Shoji, and J. Mizuno
    • Organizer
      IEEE Electronics components and technology conference (ECTC)
    • Place of Presentation
      Elara Las Vegas, US
    • Year and Date
      2016-05-31
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments2016

    • Author(s)
      W. Fu, A. Shigetou, S. Shoji , and J. Mizuno
    • Organizer
      2016 International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      札幌市教育文化会館,札幌
    • Year and Date
      2016-04-20
    • Related Report
      2016 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 低温大気圧による有機無機材料ハイブリッド化2016

    • Author(s)
      重藤 暁津
    • Organizer
      日本機械学会 研究協力事業委員会所属分科会 高密度エレクトロニクス実装技術委員会講演会
    • Place of Presentation
      東京理科大学,東京
    • Year and Date
      2016-01-29
    • Related Report
      2015 Annual Research Report
    • Invited
  • [Presentation] 高機能なハイブリッド界面創製のための低温大気圧表面改質技術2016

    • Author(s)
      重藤暁津
    • Organizer
      スマートプロセス学会 第13回電子デバイス実装研究会
    • Place of Presentation
      日本橋ライフサイエンスビル,東京
    • Related Report
      2016 Annual Research Report
    • Invited
  • [Presentation] ハイブリッド界面創製のための低温大気圧表面改質技術2016

    • Author(s)
      重藤暁津
    • Organizer
      日本溶接学会はんだ・微細接合部会シンポジウム
    • Place of Presentation
      溶接会館,東京
    • Related Report
      2016 Annual Research Report
    • Invited
  • [Presentation] 軽量スマート構造材料を指向したハイブリッド接合技術2016

    • Author(s)
      重藤暁津
    • Organizer
      エレクトロニクス実装学会機能性ハイブリッド材料公開研究会
    • Place of Presentation
      回路会館,東京
    • Related Report
      2016 Annual Research Report
    • Invited
  • [Presentation] Low Temperature Direct Bonding of Polyether Ether Ketone (PEEK) and Pt2015

    • Author(s)
      W. Fu, A. Shigetou, S. Shoji, and J. Mizuno
    • Organizer
      10th International Microsystems, Packaging, Assembly and Circuits Technology Conference
    • Place of Presentation
      Taipei World Trade Center, Taipei, Taiwan
    • Year and Date
      2015-10-21
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] パワーエレクトロニクス材料の低温大気圧ハイブリッド接合2015

    • Author(s)
      重藤暁津
    • Organizer
      NIMSフォーラム
    • Place of Presentation
      東京国際フォーラム,東京
    • Year and Date
      2015-10-07
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research / Invited
  • [Presentation] Low temperature hybrid bonding at atmospheric pressure by using vacuum ultraviolet and vapor-assisted method2015

    • Author(s)
      Akitsu Shigetou
    • Organizer
      2015 National Taiwan University - National Institute for Materials Science Joint Workshop
    • Place of Presentation
      National Taiwan University, Taipei, Taiwan
    • Year and Date
      2015-09-10
    • Related Report
      2015 Annual Research Report
    • Invited
  • [Presentation] 低温大気圧接合による材料ハイブリッド化手法および装置2015

    • Author(s)
      重藤暁津
    • Organizer
      物質・材料研究機構 新技術説明会
    • Place of Presentation
      JST東京本館別館,東京
    • Year and Date
      2015-09-03
    • Related Report
      2015 Annual Research Report
    • Invited
  • [Presentation] Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron Pitch2015

    • Author(s)
      M. Ohyama, M. Niura, J. Mizuno, S. Shoji, M. Tamura, and A. Shigetou
    • Organizer
      IEEE Electronic Component and Technology Conference (ECTC)
    • Place of Presentation
      Sheraton San Diego, San Diego, CA, USA
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Temperature2015

    • Author(s)
      A. Shigetou, J. Mizuno, and S. Shoji
    • Organizer
      IEEE Electronic Component and Technology Conference (ECTC)
    • Place of Presentation
      Sheraton San Diego, San Diego, CA, USA
    • Year and Date
      2015-05-26
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Temperature2015

    • Author(s)
      A. Shigetou, J. Mizuno, and S. Shoji
    • Organizer
      EEE/CPMT International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      京都テルサ,京都
    • Year and Date
      2015-04-14
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] Low Temperature Hybrid Bonding at Atmospheric Pressure by Using Vacuum Ultraviolet (VUV) / Vapor-Assisted Method / Low Temperature Hybrid Bonding at Atmospheric Pressure by Using Vacuum Ultraviolet (VUV) / Vapor-Assisted Method2015

    • Author(s)
      重藤暁津,細田奈麻絵,水野潤,庄子習一
    • Organizer
      日本化学会第95春季年会
    • Place of Presentation
      日本大学船橋,千葉
    • Year and Date
      2015-03-26 – 2015-03-29
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] SiCならびにGaNの低温大気圧2015

    • Author(s)
      重藤暁津
    • Organizer
      エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学,東京
    • Year and Date
      2015-03-16 – 2015-03-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] 材料ハイブリッド化のツールとしての低温大気圧接合技術2014

    • Author(s)
      重藤暁津
    • Organizer
      応用物理学会 2014年度第5回TSV応用研究会
    • Place of Presentation
      福岡システムLSI総合開発センター,福岡
    • Year and Date
      2014-12-17
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Bonding technology in ambient air: For hybridization of electronic devices2014

    • Author(s)
      重藤暁津
    • Organizer
      機械学会 ワイドバンドギャップ半導体デバイスに関わる超精密加工プロセス研究会
    • Place of Presentation
      ダブルツリーヒルトン沖縄,沖縄
    • Year and Date
      2014-10-24
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Vacuum Ultraviolet (VUV) / Vapor-Assisted Bonding for Organic / Inorganic Hybrid Integration2014

    • Author(s)
      Akitsu Shigetou, Ajayan Mano, Jun Mizuno and Shoji Shuichi
    • Organizer
      応用物理学会 Solid State Devices and Materials (SSDM)
    • Place of Presentation
      つくばエポカル,茨城
    • Year and Date
      2014-09-08 – 2014-09-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] 水和物架橋低温接合技術の開発2014

    • Author(s)
      重藤暁津
    • Organizer
      革新的構造材料等技術開発プロジェクト
    • Place of Presentation
      軽井沢,長野
    • Year and Date
      2014-06-16
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Vapor-assisted bonding method as a tool for materials hybridization in future 3D integration2014

    • Author(s)
      Akitsu Shigetou, Ajayan Mano, Jun Mizuno and Shoji Shuichi
    • Organizer
      IUMRS-ICEM 2014
    • Place of Presentation
      台湾国立大学,台湾
    • Year and Date
      2014-06-11 – 2014-06-13
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] ハイブリッド材料創製のための低温大気圧接合手法2014

    • Author(s)
      重藤暁津
    • Organizer
      第二回 NIMS-DENKA講演会
    • Place of Presentation
      デンカイノベーションセンター町田,神奈川
    • Year and Date
      2014-06-02
    • Related Report
      2014 Annual Research Report
    • Invited
  • [Presentation] Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration2014

    • Author(s)
      Masaki Ohyama, Jun Mizuno, Syuichi Shoji, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, and Akitsu Shigetou
    • Organizer
      International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      富山国際会議場,富山
    • Year and Date
      2014-04-23 – 2014-04-26
    • Related Report
      2014 Annual Research Report
  • [Presentation] Room-Temperature Direct Bonding of Graphene Films by Means of Vacuum Ultraviolet (VUV) / Vapor-Assisted Method2014

    • Author(s)
      Ajayan Mano, Akitsu Shigetou, Jun Mizuno, and Shuichi Shoji
    • Organizer
      International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      富山国際会議場,富山
    • Year and Date
      2014-04-23 – 2014-04-26
    • Related Report
      2014 Annual Research Report
  • [Book] エレクトロニクス実装学会誌(特集記事:研究室訪問 国立研究開発法人物質・材料研究機構機能性材料研究拠点光機能分野プラズモニ クスグループ)2017

    • Author(s)
      宮崎英樹 重藤暁津
    • Total Pages
      1
    • Publisher
      (社)エレクトロニクス実装学会
    • Related Report
      2017 Annual Research Report

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Published: 2014-04-04   Modified: 2022-02-22  

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