Low-temperature sintering bonding process of ceramics using reduction reaction of metal oxide
| Project/Area Number |
26289248
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Partial Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Composite materials/Surface and interface engineering
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| Research Institution | Osaka University |
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Principal Investigator |
HIROSE Akio 大阪大学, 工学(系)研究科(研究院), 教授 (70144433)
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| Co-Investigator(Kenkyū-buntansha) |
佐野 智一 大阪大学, 工学(系)研究科(研究院), 准教授 (30314371)
松田 朋己 大阪大学, 工学(系)研究科(研究院), 助教 (30756333)
小椋 智 大阪大学, 工学(系)研究科(研究院), 助教 (90505984)
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| Project Period (FY) |
2014-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥15,470,000 (Direct Cost: ¥11,900,000、Indirect Cost: ¥3,570,000)
Fiscal Year 2016: ¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2015: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2014: ¥6,110,000 (Direct Cost: ¥4,700,000、Indirect Cost: ¥1,410,000)
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| Keywords | 接合 / 焼結 / 酸化銀 / 還元反応 / ナノ粒子 / セラミックス / 酸化還元 / 分子動力学シミュレーション / 酸化物還元 / 信頼性 |
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| Outline of Final Research Achievements |
A novel low temperature direct bonding process of ceramics-to-metal without any surface metallization using a reduction reaction of silver oxide has been developed.
Typical fine ceramics of alumina, silica, aluminum nitride, silicon carbide and single crystal silicon have been successfully bonded to gold coated copper by means of the reduction reaction of silver oxide particles with diethylene glycol at bonding temperature ranging from 400℃ to 500℃. The bonding layer between ceramics and gold coated copper consisted of sintered silver derived from reduction of silver oxide.
Transmission electron microscopic observations at the bonded interfaces reveled that sintered silver layer was directly bonded to the ceramics without any interlayers. Silver ions and silver nanoparticles formed during the reduction process of silver oxide were found to contribute the interfacial bonding to ceramics. Such bonding behavior was confirmed by molecular dynamics simulation.
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Report
(4 results)
Research Products
(37 results)
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[Presentation] CuO還元反応を用いたCu-Cu接合2017
Author(s)
八尾崇史, 松田朋己, 石井克典, 佐野智一, 廣瀬明夫, 森川千晶, 大渕敦司, 屋代恒
Organizer
第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
Place of Presentation
パシフィコ横浜 (神奈川県横浜市）
Year and Date
2017-01-31
Related Report
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[Presentation] Reduction Behavior of CuO Paste during Cu-to-Cu Bonding2016
Author(s)
Takafumi Yao, Tomokazu Sano, Tomoki Matsuda, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
Organizer
MATERIALS SCIENCE & TECHNOLOGY 2016 Conference and Exhibition (MS&T16)
Place of Presentation
Salt Lake City, USA
Year and Date
2016-10-23
Related Report
Int'l Joint Research
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[Presentation] Clarification of Reduction Process of CuO in Cu-to-Cu Bonding using CuO Paste2016
Author(s)
Takafumi Yao, Tomoki Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
Organizer
International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2016)
Place of Presentation
Hotel Hankyu Expo Park, Suita, Osaka, Japan
Year and Date
2016-10-17
Related Report
Int'l Joint Research
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[Presentation] Reduction Process of CuO in Cu-to-Cu Bonding Using CuO Paste2016
Author(s)
Takafumi Yao, Tomoki. Matsuda, Tomokazu Sano, Akio Hirose, Katsunori Ishii, Chiaki Morikawa, Atsushi Ohbuchi, and Hisashi Yashiro
Organizer
9th Pacific Rim International Conference on Advanced Materials and Processing (PRICM9)
Place of Presentation
Kyoto International Conference Center, Kyoto, Japan
Year and Date
2016-08-01
Related Report
Int'l Joint Research
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