| Budget Amount *help |
¥16,250,000 (Direct Cost: ¥12,500,000、Indirect Cost: ¥3,750,000)
Fiscal Year 2016: ¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Fiscal Year 2015: ¥7,150,000 (Direct Cost: ¥5,500,000、Indirect Cost: ¥1,650,000)
Fiscal Year 2014: ¥5,980,000 (Direct Cost: ¥4,600,000、Indirect Cost: ¥1,380,000)
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| Outline of Final Research Achievements |
In this research project, novel concept to ensure metal/polymer interconnection and methodology for direct fabrication of metal circuit patterns on flexibe polymer substrate have been developed, based on electrochemica deposition techniques applied for insulating polymer substrates. The following results have been ontained: (1) elucidation of deposition mechanism for metal thin films through solid-state electrochemical reaction, (2) clarification of relationship between interfacial nanostructures and adhesion of metal and polymer substrate, and (3) development of patterning process for fabrication of fine circuit patterns. We have succeeded for development of cost-effective, environmentally-friendly , and high-throughput process for next generation superfine circuits on flexible polymer substrate, for which can be applied for next liquid crystal displays and electronic paper applications.
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