Development of novel methodology for construction of adhesive metal/polymer junctions and fabrication of metal circuit patterns by electrochemical lithography
| Project/Area Number |
26289277
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Partial Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/Microstructural control engineering
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| Research Institution | Konan University |
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Principal Investigator |
AKAMATSU KENSUKE 甲南大学, フロンティアサイエンス学部, 教授 (60322202)
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| Project Period (FY) |
2014-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥16,250,000 (Direct Cost: ¥12,500,000、Indirect Cost: ¥3,750,000)
Fiscal Year 2016: ¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Fiscal Year 2015: ¥7,150,000 (Direct Cost: ¥5,500,000、Indirect Cost: ¥1,650,000)
Fiscal Year 2014: ¥5,980,000 (Direct Cost: ¥4,600,000、Indirect Cost: ¥1,380,000)
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| Keywords | ダイレクトめっき / ポリイミド / 電気化学リソグラフィー / ダイレクトメタリゼーション / 電気めっき / ダイレクトメタライズ / 無粗化接合 / 固相電気めっき / 銅ナノ粒子 |
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| Outline of Final Research Achievements |
In this research project, novel concept to ensure metal/polymer interconnection and methodology for direct fabrication of metal circuit patterns on flexibe polymer substrate have been developed, based on electrochemica deposition techniques applied for insulating polymer substrates. The following results have been ontained: (1) elucidation of deposition mechanism for metal thin films through solid-state electrochemical reaction, (2) clarification of relationship between interfacial nanostructures and adhesion of metal and polymer substrate, and (3) development of patterning process for fabrication of fine circuit patterns. We have succeeded for development of cost-effective, environmentally-friendly , and high-throughput process for next generation superfine circuits on flexible polymer substrate, for which can be applied for next liquid crystal displays and electronic paper applications.
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Report
(4 results)
Research Products
(34 results)
