| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥520,000 (Direct Cost: ¥400,000、Indirect Cost: ¥120,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
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| Outline of Final Research Achievements |
Etching process using a high concentration alkaline aqueous solution at high temperature is used to manufacture an silicon semiconductor sensor for automobiles and so on. In order to construct a future environmentally friendly processing method, we studied whether an etching in a lower concentration aqueous solution is possible.
Conventionally, in the case of a lower concentration, it has been reported that the etched surface became rough. However, in this work, it was confirmed that an use of an air bubbling or addition of the surfactant into the etching solution were effective to get a smooth etched surface. In the future, we will continue studying methods that can achieve both higher etching rate and smoothness.
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