| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Outline of Final Research Achievements |
We developed numerical methods to analyze the scalar parameters of asymptotic solutions for three-dimensional corners along the bonded interface between dissimilar anisotropic materials under mechanical and thermal loads.
We measured the delamination toughness of an interface crack between metal and molding resin in a power module, and analyzed stress intensity factors of a critical crack in a power module under thermal stress. We can expect the delamination in a power module under thermal cycle test, which needs very long testing time.
We calculated the stress-strain fields around misfit dislocations between Si and Ge using the molecular statics and the dislocation elastic theory, and found out that those stress-strain fields obtained by two methods correspond each other. We need to take account of the difference of crystal lattice constants of bonded materials in the nano-scale.
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