Strength evaluation of an interfacial corner of jointed dissimilar materials considering the multi-scale effect
| Project/Area Number |
26420022
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Kagoshima University |
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Principal Investigator |
Ikeda Toru 鹿児島大学, 理工学域工学系, 教授 (40243894)
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| Project Period (FY) |
2014-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | 界面 / 破壊 / 接合 / 応力拡大係数 / パワーモジュール / 信頼性 / ナノ薄膜 / ミスフィット転位 / 破壊力学 / はく離 / 分子静力学 / パワーデバイス / 破壊靭性値 / ナノスケール界面 / 固有値解析 |
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| Outline of Final Research Achievements |
We developed numerical methods to analyze the scalar parameters of asymptotic solutions for three-dimensional corners along the bonded interface between dissimilar anisotropic materials under mechanical and thermal loads.
We measured the delamination toughness of an interface crack between metal and molding resin in a power module, and analyzed stress intensity factors of a critical crack in a power module under thermal stress. We can expect the delamination in a power module under thermal cycle test, which needs very long testing time.
We calculated the stress-strain fields around misfit dislocations between Si and Ge using the molecular statics and the dislocation elastic theory, and found out that those stress-strain fields obtained by two methods correspond each other. We need to take account of the difference of crystal lattice constants of bonded materials in the nano-scale.
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Report
(4 results)
Research Products
(37 results)
