Development of precision control of distribution in abrasive density for next-generation single layered super abrasive grinding wheel

• Project/Area Number: 26420050
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Production engineering/Processing studies
• Research Institution: Okayama University
• Principal Investigator: Ohashi Kazuhito 岡山大学, 自然科学研究科, 教授 (10223918)
• Co-Investigator(Kenkyū-buntansha): 塚本 眞也 岡山大学, 自然科学研究科, 教授 (80163773) ; 大西 孝 岡山大学, 自然科学研究科, 助教 (90630830)
• Project Period (FY): 2014-04-01 – 2017-03-31
• Project Status: Completed (Fiscal Year 2016)
• Budget Amount: ¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000); Fiscal Year 2016: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000); Fiscal Year 2015: ¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000); Fiscal Year 2014: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
• Keywords: 総形ダイヤモンド砥石 / ダイヤモンド砥粒 / 静電場 / 砥粒密度 / シミュレーション / 静電気

Outline of Final Research Achievements

The available conditions for setting diamond abrasive grains with the required density distributions on formed grinding wheels using electrostatic force are made clear by the simulation of electrostatic field between ribbed single layered metal bond diamond wheels and electrode plates. As the results, the diamond abrasive grains could be set on the formed grinding wheel putting metal bond paste on with the grain density distribution according to the total depth of cut using the electrostatic force based on the simulation.

Research Products

• [Journal Article] Control of Setting Abrasive Grains on Single-layered Metal Bond Diamond Forming Wheel Using Electrostatic Field (2016)
  • Author(s): S. Watanabe, K. Ohashi, Y. Kakuda, S. Tsukamoto
  • Journal Title: Proceedings of 19th International Symposium on Advances in Abrasive Technology Volume: Vol. 1 Pages: 36-41
  • Peer Reviewed / Acknowledgement Compliant
• [Presentation] 静電場を用いた総形単層メタルボンドダイヤモンド砥石の砥粒密度分布制御 (2017)
  • Author(s): 辰本大輔，渡邉 智，角田悠輔，大橋一仁
  • Organizer: 2017年砥粒加工学会卒業研究発表会
  • Place of Presentation: ホテルプラザ勝川（愛知県春日井市）
• [Presentation] 単層メタルダイヤモンド砥石の砥粒密度制御法に関する基礎的研究 - 総形砥石表面近傍の静電場によるダイヤモンド砥粒の飛翔現象の検討 - (2016)
  • Author(s): 渡邉 智，大橋一仁，角田悠輔，塚本真也
  • Organizer: 2016年度精密工学会春季大会学術講演会
  • Place of Presentation: 東京理科大学 野田キャンパス
  • Year and Date: 2016-03-16
• [Presentation] Control of Setting Abrasive Grains on Single-layered Metal Bond Diamond Forming Wheel Using Electrostatic Field (2016)
  • Author(s): S. Watanabe, K. Ohashi, Y.Kakuda, S. Tsukamoto
  • Organizer: The 19th International Symposium on Advances in Abrasive Technology (ISAAT2016)
  • Place of Presentation: Stockholm (Sweden)
  • Int'l Joint Research
• [Presentation] 単層メタルボンドダイヤモンド砥石の砥粒密度制御法に関する基礎的研究 (2015)
  • Author(s): 角田悠輔，大橋一仁，渡邉 智，塚本真也
  • Organizer: 2015年度精密工学会中国四国支部高知地方学術講演会
  • Place of Presentation: 高知工科大学
  • Year and Date: 2015-11-28
• [Presentation] 一方向凝固複合材料 のスパークアウト研削機構 (2015)
  • Author(s): 竹下亮佑，大橋一仁，和久芳春，藤原貴典，塚本真也
  • Organizer: 2015年度精密工学会春季大会学術講演会
  • Place of Presentation: 東京
  • Year and Date: 2015-03-18