| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2016: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2015: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2014: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
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| Outline of Final Research Achievements |
When the laser is scanned on the glass surface under certain conditions, there is a phenomenon that mirror surface grooves and curled glass pieces are generated on the glass substrate. This phenomenon is thought to occur by the horizontal crack progressed using thermal stress by laser. In this research, we clarify the mechanism of this phenomenon and aim to develop new removal processing technology of brittle material. In this research period, first, we experiment a processing to apply this phenomenon to a glass surface narrower than the laser heating area, and measure the crack depth and tip position. Then, we compared the distribution of stress intensity factors obtained by FEM analysis and experimental results. And, this mechanism was discussed from these results. Finally, the optimal shape and minimum dimensions of the initial crack were predicted from the stress intensity factor.
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