Development of stress measurement gauge under high temperature range using nickel alloy foil

• Project/Area Number: 26420078
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Design engineering/Machine functional elements/Tribology
• Research Institution: Tottori University
• Principal Investigator: Yuichi Ono 鳥取大学, 工学(系)研究科(研究院), 教授 (50335501)
• Co-Investigator(Kenkyū-buntansha): 森戸 茂一 島根大学, 総合理工学研究科, 准教授 (00301242)
• Project Period (FY): 2014-04-01 – 2017-03-31
• Project Status: Completed (Fiscal Year 2016)
• Budget Amount: ¥4,940,000 (Direct Cost: ¥3,800,000、Indirect Cost: ¥1,140,000); Fiscal Year 2016: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000); Fiscal Year 2015: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000); Fiscal Year 2014: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
• Keywords: 応力測定 / 金属疲労 / 実験応力解析 / 応力・ひずみ計測 / めっき法 / 電子線後方散乱回折法 / 疲労

Outline of Final Research Achievements

A nickel foil and a nickel alloy foil were produced by electroplating. It was confirmed that the recrystallization temperature of the nickel alloy foil was higher than that of the nickel foil. Cyclic loading tests were performed and it became clear that the stress can be measured from the density and crystallographic orientation of the grown grains of the nickel foil under the ambient temperature of 250 ℃.　Although the grain growth of the nickel alloy foil could be confirmed at the ambient temperature of 350 ℃, we could not derive the calibration equation for measuring the cyclic stress.

Research Products

• [Journal Article] 電着ニッケル薄膜を利用した繰返し応力測定法（成長粒子の発生密度と優先方位に着目した方法） (2016)
  • Author(s): 小野勇一，八木康行，原田拓也
  • Journal Title: 実験力学 Volume: 15 Pages: 282-288
  • NAID: 130005120936
  • Peer Reviewed / Acknowledgement Compliant
• [Journal Article] 電着ニッケル薄膜を用いた繰返し応力測定法（計測可能な応力と雰囲気温度の検討） (2016)
  • Author(s): 小野勇一
  • Journal Title: 実験力学 Volume: 16 Pages: 215-220
  • NAID: 130005266465
  • Peer Reviewed / Acknowledgement Compliant
• [Presentation] 電着ニッケル薄膜を用いた高応力測定法 (2015)
  • Author(s): 小野勇一
  • Organizer: 日本実験力学会 分科会合同ワークショップ
  • Place of Presentation: 福井県坂井氏
  • Year and Date: 2015-12-13
• [Presentation] Stress Measurement Using EBSD Analysis of Grown Grains in Electrodeposited Nickel Foil (2015)
  • Author(s): Yuichi ONO
  • Organizer: International Conference on Advanced Technology in Experimental Mechanics 2015 (ATEM’15)
  • Place of Presentation: 愛知県豊橋市
  • Year and Date: 2015-10-04
• [Presentation] 電着金属薄膜に発生する成長粒子のEBSD解析を利用した繰返し応力測定法（銅薄膜とニッケル薄膜の結晶学的特徴の比較） (2015)
  • Author(s): 小野勇一
  • Organizer: 日本機械学会東海支部第64期総会・講演会
  • Place of Presentation: 中部大学工学部
  • Year and Date: 2015-03-13 – 2015-03-14
• [Presentation] 電着ニッケル薄膜に発生する粒子の結晶方位を利用した主応力測定法 (2015)
  • Author(s): 原田拓也，小野勇一，宮近幸逸
  • Organizer: 日本機械学会中国四国支部第53期総会・講演会
  • Place of Presentation: 近畿大学工学部
  • Year and Date: 2015-03-06
• [Presentation] 電着ニッケル薄膜に発生する成長粒子の結晶方位を利用した応力測定法 (2015)
  • Author(s): 小野勇一
  • Organizer: 応力・ひずみ測定と強度評価シンポジウム
  • Place of Presentation: 日本非破壊検査協会 亀戸センター
  • Year and Date: 2015-01-10
• [Presentation] 電着ニッケル薄膜を用いた繰返し応力測定法 (2014)
  • Author(s): 小野勇一
  • Organizer: 日本非破壊検査協会平成26年度秋季講演大会
  • Place of Presentation: 名古屋国際会議場
  • Year and Date: 2014-10-28 – 2014-10-29