| Budget Amount *help |
¥5,200,000 (Direct Cost: ¥4,000,000、Indirect Cost: ¥1,200,000)
Fiscal Year 2016: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2015: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
Fiscal Year 2014: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
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| Outline of Final Research Achievements |
This study deals with one of solid state bonding techniques, “ultrasonic bonding” which utilizes high frequency vibration to bond metals. The bonding phenomena is analyzed by a combination approach of microstructural evaluation of bonding interface and dynamic motion analysis using in-situ observation. The study revealed that the correlation of a relative motion involving the bonding metals and bonding tools to apply the vibration, as well as the microstructural evolution at the bonding interface. A new ultrasonic bonding technique capable of high speed and high reliability bonding has been discussed.
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