| Project/Area Number |
26420751
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/Microstructural control engineering
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| Research Institution | Osaka Municipal Technical Research Institute |
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Principal Investigator |
Mizuuchi Kiyoshi 地方独立行政法人大阪市立工業研究所, 加工技術研究部, 研究主幹 (60416344)
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| Co-Investigator(Kenkyū-buntansha) |
井藤 幹夫 大阪大学, 工学研究科, 准教授 (00294033)
上利 泰幸 地方独立行政法人大阪市立工業研究所, 加工技術研究部, 研究フェロー (70416288)
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| Research Collaborator |
INOUE Kanryu
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| Project Period (FY) |
2014-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥5,200,000 (Direct Cost: ¥4,000,000、Indirect Cost: ¥1,200,000)
Fiscal Year 2016: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2015: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2014: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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| Keywords | 金属基複合材料 / 放熱材料 / 粉末冶金 / 熱伝導 / 熱膨張係数 / ダイヤモンド / 放電プラズマ焼結 / 界面 / アルミニウム / 銅 / 銀 / 固液共存状態 / 材料加工・組織制御工学 / 粉末プロセス・粉末冶金 / パルス通電 / 複合材料 |
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| Outline of Final Research Achievements |
To fabricate high-performance thermal management materials with ultra-high thermal conductivities and low CTEs, metal-matrix composites (MMCs) containing high thermal conductive fillers were fabricated. To avoid the damage of filler particle surfaces, spark plasma sintering (SPS) processing was used as a processing technique. Al, Cu and Ag powder were used as matrix materials, and diamond, SiC, and cBN powder were used as filler particles. Various kinds of MMCs, Al/Diamond, Al/cBN, Al/SiC, Cu/Diamond and Ag/Diamond, were fabricated by SPS process. Al-matrix composites were fabricated in solid-liquid co-existent state and thermal conductivity higher than 500 W/mK was obtained. Ag matrix composite could be successfully fabricated by valuable solidus ratio type consolidation. Bimodal filler particle effect was confirmed for these Al matrix and Ag matrix composites. The addition of B and Cr were effective for thermal conductivity enhancement of Cu/Diamond composites.
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