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High speed and high aspect ratio reactive ion etching by using high density and ion orbit controlled plasma

Research Project

Project/Area Number 26790066
Research Category

Grant-in-Aid for Young Scientists (B)

Allocation TypeMulti-year Fund
Research Field Plasma electronics
Research InstitutionNational Institute of Advanced Industrial Science and Technology

Principal Investigator

MOTOMURA Taisei  国立研究開発法人産業技術総合研究所, 製造技術研究部門, 研究員 (00635815)

Research Collaborator TAKAHASHI Kazunori  
ANDO Akira  
Project Period (FY) 2014-04-01 – 2016-03-31
Project Status Completed (Fiscal Year 2015)
Budget Amount *help
¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2015: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Fiscal Year 2014: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Keywordsプラズマ / エッチング / プラズマエッチング
Outline of Final Research Achievements

In this study, combination of high density plasma production and ion orbit control method was suggested for the achievement of the high speed plasma etching process up to 50um/min with the aspect ratio of two (20um dimeter and 50um depth). From the experimental results, high density plasma production of >1012 cm-3 and etching speed of 6.0um/min were achieved under the experimental conditions of the SF6 gas pressure of 0.2 Pa and the RF input power of 500 W. A plasma process condition provided the high speed and high aspect ratio etching will be studied in the near future. An experimental setup having high vacuum conductance, a high gas pressure operation and an additive gas (e.g., O2) control system will be key issues for next study.

Report

(3 results)
  • 2015 Annual Research Report   Final Research Report ( PDF )
  • 2014 Research-status Report
  • Research Products

    (4 results)

All 2016 2015 2014

All Journal Article (2 results) (of which Peer Reviewed: 2 results,  Open Access: 2 results,  Acknowledgement Compliant: 2 results) Presentation (2 results) (of which Int'l Joint Research: 1 results)

  • [Journal Article] Evaluation of SF<sub>6</sub> Reactive Ion Etching Performance with a Permanent Magnet Located behind the Substrate based on a Simple Design Concept2016

    • Author(s)
      Taisei Motomura, Kazunori Takahashi, Yuji Kasashima, Kazuya Kikunaga, Fumihiko Uesugi and Akira Ando
    • Journal Title

      Journal of the Vacuum Society of Japan

      Volume: 59 Issue: 1 Pages: 11-15

    • DOI

      10.3131/jvsj2.59.11

    • NAID

      130005123319

    • ISSN
      1882-2398, 1882-4749
    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Journal Article] Effect of External Magnetic Field on Compact Inductively-coupled Reactive Ion Etching Reactor2015

    • Author(s)
      Taisei Motomura, Kazunori Takahashi, Yuji Kasashima, Fumihiko Uesugi, Akira Ando
    • Journal Title

      Journal of the Vacuum Society of Japan

      Volume: 58 Issue: 10 Pages: 392-396

    • DOI

      10.3131/jvsj2.58.392

    • NAID

      130005106937

    • ISSN
      1882-2398, 1882-4749
    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Open Access / Acknowledgement Compliant
  • [Presentation] Plasma discharge characteristics in compact SF6 radio-frequency plasma source for plasma etching application2015

    • Author(s)
      Taisei Motomura, Kazunori Takahashi, Yuji Kasashima, Fumihiko Uesugi and Akira Ando
    • Organizer
      ICRP-9 / GEC-68 / SPP-33
    • Place of Presentation
      Hawaii Convention Center(USA)
    • Year and Date
      2015-10-13
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 超高速エッチングのための高密度プラズマについて2014

    • Author(s)
      本村大成, 高橋和貴, 笠嶋悠司, 安藤晃, 上杉文彦, クンプアンソマワン, 原史朗
    • Organizer
      第2回産総研プラズマワークショップ
    • Place of Presentation
      産業技術総合研究所九州センター
    • Year and Date
      2014-04-14
    • Related Report
      2014 Research-status Report

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Published: 2014-04-04   Modified: 2017-05-10  

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