| Budget Amount *help |
¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
Fiscal Year 2016: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2015: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2014: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
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| Outline of Final Research Achievements |
In order to decrease usage amount of CeO2 for chemical mechanical polishing (CMP) of a glass substrate, theoretical design of an alternative abrasive grain for a CeO2 abrasive grain and dispersing that improves the performance of the slurry with the abrasive grain is aimed to be estalished by computational simulation method. The first-principles calculation result shows that a CeO2 cluster on TiO2(110) takes a lower charge value of Ce atoms than a CeO2 bulk. This implies the increase in the reactivity for glass substrate of the Ce atoms. The potential parameters between beads of the abrasive grains (La-doped CeO2 and SrFeO3), water molecule, and polymer molecules (polyacrylic acid and polyvinylpyrrolidone) for coarse-grained molecular dynamics simulation are determined by first-principles calculation. Moreover, dispersion simulation of the abrasive grain and polymer in the slurry by coarse-grained molecular dynamics method are performed.
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