| Project/Area Number |
26820124
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Electron device/Electronic equipment
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| Research Institution | Gunma University |
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Principal Investigator |
KOYAMA Shinji 群馬大学, 大学院理工学府, 准教授 (70414109)
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| Project Period (FY) |
2014-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
Fiscal Year 2016: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
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| Keywords | 低温接合 / 電子デバイス / 精密接合 / 固相接合 / 液相拡散接合 / 金属塩生成接合法 / インサート金属 / アルミニウム / チタン / 銅 / ステンレス鋼 / ギ酸 / クエン酸 / 接合 |
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| Outline of Final Research Achievements |
The application of low-temperature bonding in industrial processes has been explored in an effort to miniaturize electronic equipment. However, low-temperature bonding has been difficult to achieve because of the presence of oxide film. Therefore, an economical method to obtain a high-tensile strength joint at a low temperature and load is required. In previous research showed that surface modification with organic acid decreased the bonding temperature and the deformation in the solid-state bonding of Al and Cu. Therefore, in this investigation, we aimed to obtain a deeper understanding of the effect of surface modification on the performance of a solid-state bonded joint of Al alloy/pure Zn and pure Ti/pure Al. When surface modification is applied, it is clarified that a high-tensile strength joint can be obtained at a low temperature because metallic Zn and Al are exposed as a result of the decomposition of metal salt in the bond interface at a low bonding temperature.
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