| Project/Area Number |
26889075
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| Research Category |
Grant-in-Aid for Research Activity Start-up
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| Allocation Type | Single-year Grants |
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| Research Field |
Properties in chemical engineering process/Transfer operation/Unit operation
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| Research Institution | National Institute of Advanced Industrial Science and Technology |
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Principal Investigator |
Kusaka Yasuyuki 国立研究開発法人産業技術総合研究所, フレキシブルエレクトロニクス研究センター, 研究員 (00738057)
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| Project Period (FY) |
2014-08-29 – 2016-03-31
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| Project Status |
Completed (Fiscal Year 2015)
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| Budget Amount *help |
¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Fiscal Year 2015: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2014: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
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| Keywords | 印刷エレクトロニクス / 付着力 / レオロジー / 界面 / シリコーンゴム / 乾燥 / 界面破壊 / パターニング / ナノ粒子 |
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| Outline of Final Research Achievements |
Printed electronics have gathered considerable attention as a next-generation manufacturing process for electronic devices because of their simplicity and cost-effectiveness. To clarify semi-drying mechanism in silicone-based printing techniques, we investigated a relation between transferring quality and the roles of the rheological and adhesive characteristics of semi-dried inks. On the basis of colloidal probe force measurements, it was established that not only enough rigidity but also appropriate adhesive force is required to attain high-quality patterns. We also developed several techniques including (i) embedded electrode formation, (ii) push-pull process for bottom-contact free patterning, (iii) reflow of semi-dried inks for formation of taper structure, and (iv) adhesion contrast planography. The results obtained here not only provide a framework for analyzing printing mechanisms but also a set of processing tools for electronic device fabrications by printing.
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