Diffusion welding of SiC Fiber-reinforced Aluminum- base Alloy Composite

Research Project

Project/Area Number	60550520
Research Category	Grant-in-Aid for General Scientific Research (C)
Allocation Type	Single-year Grants
Research Field	溶接工学
Research Institution	Muroran Institute of Technology
Principal Investigator	MOMONO Tadashi Muroran Institute of Technology, 工学部, 助教授 (10002940)
Project Period (FY)	1985 – 1986
Project Status	Completed (Fiscal Year 1986)
Budget Amount *help	¥1,900,000 (Direct Cost: ¥1,900,000) Fiscal Year 1986: ¥400,000 (Direct Cost: ¥400,000) Fiscal Year 1985: ¥1,500,000 (Direct Cost: ¥1,500,000)
Keywords	Diffusion Welding / Diffusion Bonding / Insert-metal / Electrolytic Polishing / FRM / 複合材料 / SiC繊維
Research Abstract	An investigation has been made of the diffusion welding of SiC fiber-reinforced aluminum-base alloy composite which is very difficult to join by the conventional fusion-welding technique. The welding was made using Al-Cu-Mg series alloy (2017, 2024 alloy) and Al-5%Ca alloy as insert-metals at 540゜C to 630゜C in 1x <10^(-4)> Torr. The rapidly cooled Al-5%Ca alloy foil, 10 mm in width and 40-50 <mu> m thick, were produced by liquid quenching. From the experiment, the following results are obtained. (1) A higher bond strength for the Al-Al weldment is obtained by using electrolytic polishing. (2) The projection of SiC fiber on the welding surface is caused by the electrolytic polishing. The projecting fibers play an important role in improvement of tensile and bend strength of the joint. (3) Diffusion welding of Al to FRM using 2017 and 2024 alloy foils have been caried out in the temperature range above the solidus line where solid and liquid phases coexist. The maximum tensile strength was obtained when the volume fraction of the liquid phase was 1-5%. (4) The weldments made with Al-5%Ca alloy foil at the welding temperature of 630゜C for 180 min have the maximum tensile strength. This is attributable to acceleration of the interface reaction between SiC fiber and Al matrix by Ca.