| Project/Area Number |
62550506
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| Research Category |
Grant-in-Aid for General Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Research Field |
金属加工(含鋳造)
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| Research Institution | Osaka Institute of Technology |
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Principal Investigator |
SAIJI Masaki Osaka Institute of Technology Dept. of Mechanical Engineering, 工学部機械工学科, 教授 (30079537)
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| Project Period (FY) |
1987 – 1988
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| Project Status |
Completed (Fiscal Year 1988)
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| Budget Amount *help |
¥1,800,000 (Direct Cost: ¥1,800,000)
Fiscal Year 1988: ¥300,000 (Direct Cost: ¥300,000)
Fiscal Year 1987: ¥1,500,000 (Direct Cost: ¥1,500,000)
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| Keywords | drawing / lubrication / acoustic emission technique / stress wave / ringdown count rate / energy count rate |
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| Research Abstract |
Stress wave signals generated by metallic contacts at the dieworkpiece interface are detected by using a piezoelectric sensor, and are processed into a ringdown count rate, an energy count rate and a power spectrum. The wire drawings of aluminum are carried out under different conditions of the drawing speed and the reduction in area. Lubricants used are the mixture of polybutene and kerosene. Relationships between the ringdown count rate or the energy count rate of the stress waves and the thickness of oil film are obtained. The relationships are discussed from viewpoints of the surface of drawn wire and the die surface.
Main results obtained are as follows;
1) From the relationships between the ringdown count rate C and the threshold voltage V on a semi-logarithmic representation, the C shows linear or parabolic decrease with increasing the V for changing in lubrication.
2) From the results of power spectrum for stress waves, the stress wave shows the distribution of a strength in 100-300kHz band for good lubrication, while the stress wave under seizure shows the wide distribution of band centering around 600kHz in addition to 100-300kHz band.
3) The energy count rate in a useful processed signal for evaluating the lublication involving the imitation and the growth of seizure.
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