Analyses of Stress and Strain in IC Board and Prevention techniques of Board Fracture
| Project/Area Number |
63460077
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| Research Category |
Grant-in-Aid for General Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
材料力学
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| Research Institution | Kanazawa University |
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Principal Investigator |
ODA Juhachi Kanazawa University Faculty of Engineering Professor, 工学部, 教授 (30019749)
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| Co-Investigator(Kenkyū-buntansha) |
KIDA Sotoaki Kanazawa Institute of Technology Associate Professor, 助教授 (10110991)
SAKAMOTO Jirou Kanazawa University Faculty of Engineering Assistant, 工学部, 助手 (20205769)
YAMAZAKI Kouetsu Kanazawa University Faculty of Engineering Associate Professor, 工学部, 助教授 (70110608)
RYOICHI Monzen Kanazawa University Faculty of Engineering Associate Professor, 工学部, 助教授 (20166466)
KITAGAWA Kazuo Kanazawa University Faculty of Engineering Associate Professor, 工学部, 助教授 (30019757)
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| Project Period (FY) |
1988 – 1989
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| Project Status |
Completed (Fiscal Year 1989)
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| Budget Amount *help |
¥6,100,000 (Direct Cost: ¥6,100,000)
Fiscal Year 1989: ¥2,100,000 (Direct Cost: ¥2,100,000)
Fiscal Year 1988: ¥4,000,000 (Direct Cost: ¥4,000,000)
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| Keywords | IC Board / Electronic Circuit / Thermal Strain / Thermal Stress / Adhesive Bonded Structure / Finite Element Method / Thin Film |
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| Research Abstract |
Experimental and theoretical techniques to the thermal stresses of electronic circuit boards and to prevent the board fractures are studied.
The studies are summarized as follows :
(1) The fracture conditions of the practical electronic boards such as the printed electronic circuit boards and IC boards are analyzed in the viewpoints of board shape, material composition and dynamical load conditions
(2) The numerical technique to analyze the thermal stresses and strains of electronic circuit boards is proposed by using the special finite element method. The method is the application technique to analyze the adhesive bonded structure. By using the technique, the thermal stress and strain distributions of several electronic circuit boards are analyzed three-dimensionally.
(3) The models simulating the practical electronic circuits are used to analyze experimentally the thermal strain distributions. The results are compared with the theoretical results by the finite element method.
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Report
(3 results)
Research Products
(24 results)
