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Study on High Efficiency Sliceing for Hard and Brittle Materials

Research Project

Project/Area Number 63550111
Research Category

Grant-in-Aid for General Scientific Research (C)

Allocation TypeSingle-year Grants
Research Field 機械工作
Research InstitutionKANAZAWA INSTITUTE OF TECHNOLOGY

Principal Investigator

ISHIKAWA Ken-ichi  Kanazawa Institute of Technology, Department of Mechanical Engineering, Professor, 工学部, 教授 (00064452)

Project Period (FY) 1988 – 1989
Project Status Completed (Fiscal Year 1989)
Budget Amount *help
¥1,800,000 (Direct Cost: ¥1,800,000)
Fiscal Year 1989: ¥900,000 (Direct Cost: ¥900,000)
Fiscal Year 1988: ¥900,000 (Direct Cost: ¥900,000)
KeywordsAbrasive Grains / Diamond Grains / Vibration / Multiwire Sawing / Hard and Brittle Material / High Efficiency / High Accuracy / ラッピング加工 / マルチワイヤソー / 加工クラック層
Research Abstract

We studied on high efficiency sliceing for hard and brittle materials in two years. As the results, the following becomes clear.
1. In the vibration sliceing, when frequency of the wire << natural frequency of the wire, movement of the wire becomes linear.
2. The machining efficiency in the vibration slicing is an increase of 2 times compared with the non- vibration slicing by entrance of effective abrasive grains and an increase of effective slicing load.
3. The interdependence between machining efficiency in the vibration slicing and phase angle of vibrations of both sides in processing part is little.
4. Thickness of wafers after slicing shows such a tendency that the thickness in the vibration slicing is little more thin than the thickness in the nonvibration slicing. And, depression of the thickness decreases as the vibration amplitude increases.
5. Waviness of wafers after slicing shows tendency that waviness in the longitudinal direction increases slightly as the amplitude increases and the waviness in the slicing direction decreases as the amplitude increases.
6. Processing crack layer of silicone wafer in the vibration slicing shows the same value ( 6-9 mum) as it in the nonvibration slicing.
7. The apparatus to grind spiral grooves on surface of wire tool is designed and made as an experiment, and tensile stress of the spiral grooved wire tool is measured. As the results, tensile stress of the spiral grooved wire shows a decrease from 80 % to 90 % compared with the ordinary wire.
8. When the spiral grooved wire is used, the machining efficiency increases as pitch of the spiral grooves decreases. And when pitch of the spiral grooves is 2 am, the machining efficiency in the vibration slicing is a increase of 4 times compared with the ordinary wire used in the nonvibration slicing.

Report

(3 results)
  • 1989 Annual Research Report   Final Research Report Summary
  • 1988 Annual Research Report
  • Research Products

    (16 results)

All Other

All Publications (16 results)

  • [Publications] 石川憲一: "ダイヤモンド砥粒を被覆したワイヤによる振動切断に関する研究(第2報,振動の効果と加工精度)" 先端加工. 8. 51-56 (1989)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] 石川憲一: "スパイラル状溝付きワイヤ工具の開発とスライシング性能に関する基礎研究" 1989年度精密工学会秋季大会講演論文集. 785-786 (1989)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] 石川憲一: "振動マルチワイヤソ-に関する研究 第2報,振動の効果と加工精度" 日本機械学会論文集C編. 55. 2701-2706 (1989)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] 石川憲一: "振動マルチワイヤソ-に関する研究 第2報,振動の効果と加工精度" 日本機械学会東北支部盛岡地方講演会講演概要集. 136 (1989)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] 石川憲一: "振動応用工学" 金沢工業大学出版局, 311 (1989)

    • Description
      「研究成果報告書概要(和文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] Ken-ichi ISHIKAWA: "A Study on Vibration Cutting using Wire covered by Diamond Grains (2nd Report, Vibrational Effect and Cutting Accuracy)" Journal of Advanced Production Technology, 8, 51-56(1989).

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] Ken-ichi ISHIKAWA: "A Study on Vibration Multiwire Sawing (2nd Report, Vibratonal Effect and Cutting Accuracy)" Journal of JSME, 55-519, 2701-2706(1989).

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] Ken-ichi ISHIKAWA: "Applied Mechanical Vibrations" Kanazawa Institute of Technology Press, 311(1989).

    • Description
      「研究成果報告書概要(欧文)」より
    • Related Report
      1989 Final Research Report Summary
  • [Publications] 石川憲一: "ダイヤモンド砥粒を被覆したワイヤによる振動切断に関する研究(第2報、振動の効果と加工精度)" 先端加工. 8. 51-56 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] 石川憲一: "スパイラル状溝付きワイヤ工具の開発とスライシング性能に関する基礎研究" 1989年度精密工学会秋季大会講演論文集. 785-786 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] 石川憲一: "振動マルチワイヤソ-に関する研究第2報、振動の効果と加工精度" 日本機械学会論文集C編. 55. 2701-2706 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] 石川憲一: "振動マルチワイヤソ-に関する研究第2報、振動の効果と加工精度" 日本機械学会東北支部盛岡地方講演会講演概要集. 136 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] 石川憲一: "振動応用工学" 金沢工業大学出版局, 311 (1989)

    • Related Report
      1989 Annual Research Report
  • [Publications] 石川憲一: 日本機械学会論文集C編.

    • Related Report
      1988 Annual Research Report
  • [Publications] 石川憲一: 1989年度精密工学会春季大会講演論文集. (1989-3)

    • Related Report
      1988 Annual Research Report
  • [Publications] 石川憲一: "振動応用光学" 金沢工業大学出版局, (1989)

    • Related Report
      1988 Annual Research Report

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Published: 1988-04-01   Modified: 2016-04-21  

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