| Project/Area Number |
63550111
|
|---|
| Research Category |
Grant-in-Aid for General Scientific Research (C)
|
| Allocation Type | Single-year Grants |
|---|
| Research Field |
機械工作
|
|---|
| Research Institution | KANAZAWA INSTITUTE OF TECHNOLOGY |
|---|
Principal Investigator |
ISHIKAWA Ken-ichi Kanazawa Institute of Technology, Department of Mechanical Engineering, Professor, 工学部, 教授 (00064452)
|
|---|
| Project Period (FY) |
1988 – 1989
|
| Project Status |
Completed (Fiscal Year 1989)
|
| Budget Amount *help |
¥1,800,000 (Direct Cost: ¥1,800,000)
Fiscal Year 1989: ¥900,000 (Direct Cost: ¥900,000)
Fiscal Year 1988: ¥900,000 (Direct Cost: ¥900,000)
|
|---|
| Keywords | Abrasive Grains / Diamond Grains / Vibration / Multiwire Sawing / Hard and Brittle Material / High Efficiency / High Accuracy / ラッピング加工 / マルチワイヤソー / 加工クラック層 |
|---|
| Research Abstract |
We studied on high efficiency sliceing for hard and brittle materials in two years. As the results, the following becomes clear.
1. In the vibration sliceing, when frequency of the wire << natural frequency of the wire, movement of the wire becomes linear.
2. The machining efficiency in the vibration slicing is an increase of 2 times compared with the non- vibration slicing by entrance of effective abrasive grains and an increase of effective slicing load.
3. The interdependence between machining efficiency in the vibration slicing and phase angle of vibrations of both sides in processing part is little.
4. Thickness of wafers after slicing shows such a tendency that the thickness in the vibration slicing is little more thin than the thickness in the nonvibration slicing. And, depression of the thickness decreases as the vibration amplitude increases.
5. Waviness of wafers after slicing shows tendency that waviness in the longitudinal direction increases slightly as the amplitude increases and the waviness in the slicing direction decreases as the amplitude increases.
6. Processing crack layer of silicone wafer in the vibration slicing shows the same value ( 6-9 mum) as it in the nonvibration slicing.
7. The apparatus to grind spiral grooves on surface of wire tool is designed and made as an experiment, and tensile stress of the spiral grooved wire tool is measured. As the results, tensile stress of the spiral grooved wire shows a decrease from 80 % to 90 % compared with the ordinary wire.
8. When the spiral grooved wire is used, the machining efficiency increases as pitch of the spiral grooves decreases. And when pitch of the spiral grooves is 2 am, the machining efficiency in the vibration slicing is a increase of 4 times compared with the ordinary wire used in the nonvibration slicing.
|
