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1990 Fiscal Year Final Research Report Summary

Minimum Thickness of Cut in Micromachining

Research Project

Project/Area Number 01550096
Research Category

Grant-in-Aid for General Scientific Research (C)

Allocation TypeSingle-year Grants
Research Field 機械工作
Research InstitutionOsaka University

Principal Investigator

SHIMADA Shoichi  Osaka University, Department of Precision Engineering, Associate Professor, 工学部, 助教授 (20029317)

Project Period (FY) 1989 – 1990
KeywordsUltraprecision Metal Cutting / Minimum Thickness of Cut / Micromachining / Machining Accuracy / Cutting Edge Radius / Atomistic Model
Research Abstract

The minimum thickness of cut is one of the most important factor to determine the machining accuracy extremely attainable for a specific cutting condition. With the use of a specially prepared fine diamond tool on a highly reliable machine tool, very thin chips the minimum uncut thickness of which are at the order of 1 nm can be obtained in facing of Cu and Al. In the case of Al, while a new sharp cutting edge can remove the nanometric chip, it is difficult to obtain the nanometric chip stab-ly due to the poor cutting edge quality resulted from excessive tool wear. In other words, the extreme accuracy attainable in micromachining may be of the same order as that of minimum thickness of cut when the cutting edge sharpness is maintained at a few nm level. The microchip removal process at nanometric level can be well understood by the computer simulation using an atomistic cutting model in which the lattice structures of cutting edge and workpiece and their interactions are assumed. The analysis of the experimental results aided by the computer simulation show that, while the minimum thickness of cut is affected by the tool-workmaterial interaction to a certain degree, it is more strongly affected by the sharpness of cutting edge and that the minimum thickness of cut may be at the order of 1/10 of the cutting edge radius.

  • Research Products

    (6 results)

All Other

All Publications (6 results)

  • [Publications] T.Nakasuji: "Diamond Turning of Brittle Materials for Optical Components" Annals of the CIRP. 39. 89-92 (1990)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] N.Ikawa: "Minimum Thickness of Cut in Micromachining" Nanotechnology.

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] N.Ikawa: "An Atomistic Analysis of Nanometric Chip Removal as Affected by ToolーWork Interaction in Diamond Turning" Annals of the CIRP. 40. (1991)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T. Nakasuji et al.: "Diamond Turning of Brittle Materials for Optical Components" Annals of the CIRP. 39, 1. 89-92 (1990)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] N. Ikawa et al.: "Minimum Thickness of Cut in Micromachining" Nanotechnology.

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] N. Ikawa et al.: "An Atomistic Analysis of Nanometric Chip Removal as Affected by Tool-Work Interaction in Diamond Turning" Annals of the CIRP. 40. (1991)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 1993-08-12  

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