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1990 Fiscal Year Final Research Report Summary

Development of Direct Cooling Technique of Integrated Circuit Junctions

Research Project

Project/Area Number 01850047
Research Category

Grant-in-Aid for Developmental Scientific Research (B).

Allocation TypeSingle-year Grants
Research Field Thermal engineering
Research InstitutionTokyo Institute of Technology

Principal Investigator

HIJUKATA Kunio  Tokyo Inst. Tech., Faculty of Engineering, Professor, 工学部, 教授 (60016582)

Co-Investigator(Kenkyū-buntansha) NAGASAKI Takao  Tokyo Inst. Tech., Faculty of Engineering, Assistant, 工学部, 助手 (30155923)
NAKAYAMA Wataru  Tokyo Inst. Tech., Faculty of Engineering, Professor, 工学部, 教授 (50221461)
Project Period (FY) 1989 – 1990
KeywordsHeat Transfer / Integrated Circuit / Forced Convection / Boiling / Thermal Conduction / Conjugate Heat Transfer
Research Abstract

Direct cooling techniques of integrated circuit (IC) junctions have been investigated. Firstly, heat transfer from diode junctions in an IC chip, whose surface was cooled by an impinging jet of air, have been investigated. Junction temperature was measured by using its forward bias voltage. Based on the visualization of the chip surface temperature profile by an infrared imager, it was clarified that the temperature increase of each heating element is divided into two parts. One is local temperature increase near each heating element, which depends on each heating rate, and another is the increase of the average temperature of the chip, which depends on the total heat generation in the chip and is determined by the heat resistance between the chip and the ambience. An idealized experiment was also made by using small heating elements on a glass plate. It was clarified that the dependency of heat transfer rate on the air Reynolds number is small, and the thermal interaction between elements occurs when the distance between two elements becomes the same order as the size of heating element.
Secondly, characteristics of boiling heat transfer in R113 have been investigated. It was shown that the heat flux greatly depends on the thermal conductivity of the substrate, and its value is greater than that of the conventional boiling from wide surfaces due to the conduction in the substrate. Temperature fluctuation of element was also observed corresponding to the bubble formation and departure. A numerical analysis was also made on the conjugate problem of heat conduction in the chip and the cooling of its surface, and the heat transfer characteristics was correlated with nondimensional parameters, such as Biot number.

  • Research Products

    (6 results)

All Other

All Publications (6 results)

  • [Publications] 土方 邦夫: "集積回路内微小発熱素子の熱伝達に関する研究" 第26回日本伝熱シンポジウム講演論文集. 271-273 (1989)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 土方 邦夫: "基板上の微小発熱素子の強制対流冷却に関する研究" 第27回日本伝熱シンポジウム講演論文集. 805-807 (1990)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Kunio Hijikata: "A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip" Proceeding of the 3rd.ASMEーJSME Thermal Engineering Joint Conference. (1991)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] K. Hijikata: "A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip" Proc. 26th Nat. Heat Transf. Symp. Japan. 271-273 (1989)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] K. Hijikata: "A Study on Convective Heat Transfer from Small Heating Elements on a Substrate" Proc. 27th Nat. Heat Transf. Symp. Japan. 805-807 (1990)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] K. Hijikata: "A Study on Heat Transfer from Small Heating Elements in an Integrated Circuit Chip" Proc. 3rd ASME-JSME Thermal Engineering Joint Conference.

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 1993-08-12  

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