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1992 Fiscal Year Final Research Report Summary

Development of microscopic thermography for small defects

Research Project

Project/Area Number 02555019
Research Category

Grant-in-Aid for Developmental Scientific Research (B)

Allocation TypeSingle-year Grants
Research Field 機械材料工学
Research InstitutionOsaka University

Principal Investigator

OGURA Keiji  Engineering Science, Osaka University, Department of Mechanical Engineering, Professor, 基礎工学部, 教授 (70029007)

Co-Investigator(Kenkyū-buntansha) YAMANAKA Syuusuke  Mitsui Toatsu Chemicals, Inc.,Central Research Institute, Research Fellow, 技術研究所, 主席研究員
SAKAGAMI Takahide  Engineering Science, Osaka University, Department of Mechanical Engineering, Res, 基礎工学部, 助手 (50192589)
NISHIKAWA Izuru  Engineering Science, Osaka University, Department of Mechanical Engineering, Res, 基礎工学部, 助手 (90189267)
MIYOSHI Yoshio  Engineering Science, Osaka University, Department of Mechanical Engineering, Ass, 基礎工学部, 助教授 (40029434)
Project Period (FY) 1990 – 1992
KeywordsNon-destructivie inspection / Microscopic thermography / Infrared thermal image / Small flaws / Composite materials / Laminated film / Infrared transparent solid / Solid contact cooling
Research Abstract

A thermographic non-destructive inspection system, which is applicable for the examination of the small defects and damage embedded in composite and laminated materials, has been developed. The infrared thermal image of the surface of test samples is taken and analysed, when the samples are heated and cooled. A conventional scanning-type thermal imager was used to obtain the thermal image with some optional magnification lens including microscope lens. The resolution in defect size was examined both experimentally and numerically by using artificial delaminated samples. It was found that the thermal conductivity of the sample plays an important role for the resolution. The use of an efficient cooling is a key for the improvement of the resolution. A minimum delaminated flaw size in the sub-surface of GFRP and CFRP samples was around 4mm in diameter under air cooling. A smaller flaw as large as 1mm in diameter was able to detect for a copper-polyimide laminated flexible film whose thickness is exceptionaly thin (60 microns in thickness). A new and more effective cooling technique, in which an infrared transparent solid plate is in contact on the heated test sample, has been developed. The thermal image of the sample surface is obtained through the transparent plate as soon as the plate is in contact on the sample in this method. The successful flaw inspection was demonstrated both in GFRP and CFRP samples.

  • Research Products

    (12 results)

All Other

All Publications (12 results)

  • [Publications] Takahide SAKAGAMI,Keiji OGURA: "A New Technique for the Damage Inspection of CFRP Using Thermal Imaging" Proc.of the 9th International Conference on Experinamtal Mechanics. 526-535 (1990)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 小倉 敬二,阪上 隆英,多賀 之高,山中 秀介: "赤外線映像装置を用いた複合材料および接合材料の欠陥検出" 日本材料学会第6回破壊力学シンポジウム講演論文集. 1-5 (1991)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Keiji OGURA,Takahide SAKAGAMI: "A New Inspection Technique for Small Flaws and Dfects Using Infrared Thermography" Proc.of ASME-JSME Joint Conference on Electronic Packaging,. 909-915 (1992)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 阪上 隆英,小倉 敬二: "ジュール熱による瞬時加熱温度場のサーモグラフィ計測に基づく防破壊欠陥計測" 日本機械学会論文集(A編). 58巻. 2224-2231 (1992)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 小倉 敬二,阪上 隆英,多賀 之高,ほか2名: "赤外線サーモグラフィを用いた銅-ポリイミド接合フィルムの微小欠陥検出" 日本機械学会論文集. 920-78. 453-455 (1992)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 小倉 敬二,阪上 隆英,山中 秀介,木島 重基: "表面温度分布の転写計測によるFPC基板中の微小欠陥計測" 第4回新素材及びその製品の非破壊評価シンポジウム講演論文集. 59-64 (1993)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Takahide SAKAGAMI, Keiji OGURA: "A New Technique for the Damage Inspection of CFRP Using Thermal Imaging" Proc. of 9th International Conference on Experimental Mechanics. 526-535 (1990)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Keiji OGURA, Takahide SAKAGAMI, Yukitaka TAGA, Shuusuke YAMANAKA: "A New Flaw Inspection Technique for Composites and Bonded Materials Using Infrared Thermovision" Proc. of 6th Symposium on Fracture and Fracture Mechanics. 1-5 (1991)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Keiji OGURA, Takahide SAKAGAMI: "A New Inspection Technique for Small Flaws and Defects Using Infrared Thermography" Proc. of ASME-JSME Joint Conference on Electronic Packaging. 909-915 (1992)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Takahide SAKAGAMI, Keiji OGURA: "A New Flaw Inspection Technique Based on Infrared Thermal Images Under Joule Effect Heating" Transactions of the Japan Society of Mechanical Engineers, Vol.58, No.555. 2224-2231 (1992)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Keiji OGURA, Takahide SAKAGAMI, Uukitaka TAGA: "Shuusuke YAMANAKA, Shigemoto KIJIMA Thermal Imaging NDT Technique for Small Defects in Copper-Polyimide Laminate Films" Proc. of the 70th JSME Fall Annual Meeting. 920-78. 453-455 (1992)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Keiji OGURA, Takahide SAKAGAMI, Shuusuke YAMANAKA, Shigemoto KIJIMA: "A New Technique for the Flaw Inspection in Laminated Composites Using Contact Cooling by an IR Transmissive Solid" Proc. of the 4th Symposium on Nondestructive Evaluation for New Materials. 59-64 (1993)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 1994-03-24  

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