1993 Fiscal Year Final Research Report Summary
Development of Effective Method for Detecting the Contact Conditions between Dies and Thermosetting Resin Compound and the Solidification Front in Transfer Molding Processes
Project/Area Number |
03452115
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Research Category |
Grant-in-Aid for General Scientific Research (B)
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Allocation Type | Single-year Grants |
Research Field |
機械工作
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Research Institution | KUMAMOTO UNIVERSITY |
Principal Investigator |
SAIKI Hiroyuki Kumamoto University, Faculty of Engineering, Professor, 工学部, 教授 (40023238)
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Co-Investigator(Kenkyū-buntansha) |
SAKAMOTO Hidetoshi Kumamoto University, Faculty of Engineering, Assistant Professor, 工学部, 助教授 (10153917)
MARUMO Yasuo Kumamoto University, Faculty of Engineering, Assistant Professor, 工学部, 助教授 (90199927)
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Project Period (FY) |
1991 – 1993
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Keywords | Thermosetting Resin / Thermal Contact Condition / Ultrasonic wave / Contact Ratio / Solidification Front / Geometric Accuracy / Die Separation / Reflection of Wave |
Research Abstract |
The reflection of ultrasonic wave depends on a real contact area between die and material, acoustic impedance of interface materials, and a contact geometry of the interface. In this experiment we examined the maximum wave intensities reflected from upper and lower flat die surfaces during a molding process. The relative intensity of the reflecting wave was defined as ratio of the intensity during molding to that before molding. The change in the relative intensity has corresponded sensitively with a filling rate or a contact ratio of the resin at the interface, development of solidification of the resin because of the change in acoustic impedance and the separation of resin from the die surface due to the shrinkage of molded material. It has been also clarified that the relative intensity has the close relation with overall thermal resistance at the interface. Thus, a newly developed method measuring transient contact conditions provides the effective tool to optimize the process coditions for forming accurate shapes or good properties.
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