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1992 Fiscal Year Final Research Report Summary

An practical study on improving the lifetime of FPC with controlling the viscoelastic properties of adhesives

Research Project

Project/Area Number 03555021
Research Category

Grant-in-Aid for Developmental Scientific Research (B)

Allocation TypeSingle-year Grants
Research Field 材料力学
Research InstitutionIBARAKI UNIVERSITY

Principal Investigator

SUZUKI Hideto  PROFESSOR IBARAKI UNIVERSITY, FACULTY OF ENGINEERING DEPARTMENT OF SYSTEM ENGINEERING, 工学部, 教授 (30090369)

Co-Investigator(Kenkyū-buntansha) KURODA Nobukazu  DIVISION MANAGER SONY CHEMICALS CORP., PRODUCT DEVELOP. DIVISION, 部長
Project Period (FY) 1991 – 1992
KeywordsFlexible printed circuits / Adhesives / Fatigue / Glass transition temperature / Fractography / Reliability / Film / Viscoelastics
Research Abstract

The fatigue reliability on the functional disorder of flexible printed circuit, FPC was experimentally studied upon the basis of the conventional works on the fatigue of structural materials. Especially, the size effect of component materials and mechanical properties of adhesives on NG life of FPC, Nf that is the electric resistance rising up to 10% of the original value, were examined under strain repetition.
It was found by cyclic flexural testing that Nf could be improved by thinning the copper foil and also adhesives but inversely by thinning Kapton of the base material. Nf was related to the maximum strain of copper epsilon as the straight relation of epsilon * Nf in the log-log diagram. Then, it can be understood that the size effects in the copper conductor and the polyimide base are due to the strain of copper, epsilon. While, from the relation between the tensile properties of adhesives and Nf, it is suggested that the adhesive agent should be provided either flexibility and strength in order to improve FPC life.
The fractography with SEM showed that the fatigue process of copper foil could be divided into three stages as follows:(1)the crack initiation, (2)the crack density increase, (3)the crack opening. Then, Nf was corresponded to the stage of (1), the crack initiation.
Furthermore, it was experimentally found that the lifetime of FPC could be varried through controlling the glass transition temperature, Tg of adhesives and the tensile properties of cover films of super engineering plastic. By increasing Tg of adhesives or controlling its viscoelasstic property, the life time of FPC can be remarkably improved.

  • Research Products

    (3 results)

All Other

All Publications (3 results)

  • [Publications] Hideto SUZUKI Ryo ITO Shin-ichi KURODA Masao SHIMIZU: "The Basic Study on the Fatigve Reliability of Flexible Printed Ciraicts:Ettects of Component-Materials Thichness and Manisl Properties of Adhensives on the ¨Functional Disorder¨" Proc.of the 1992 Joint ASME/JSME Conterence on Electronic Packaging. 2. 803-808 (1992)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Hideto Suzuki, Ryo Ito and Shin-ichi Kuroda: "Influence of Adhesive on the Lifetime of Flexible Printed Circuits" Proc. of Symposium on Reliability of Products. No.910-49. 23-28 (1991)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Hideto Suzuki, Ryo Ito, Shin-ichi Kuroda and Masao Shimizu: "The Basic Study on the Fatigue Reliability of Flexible Printed Circuits: Effects of Component-materials Thickness and Mechanical Properties of Adhesives on Functional Disorder" Proc. of the 1992 Joint ASME/JSME Conference on Electronic Packing. VOL.2. 803-808 (1992)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 1994-03-24  

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