1992 Fiscal Year Final Research Report Summary
Joining of Ceramics to Metals
| Project/Area Number |
03650558
|
|---|
| Research Category |
Grant-in-Aid for General Scientific Research (C)
|
| Allocation Type | Single-year Grants |
|---|
| Research Field |
金属加工(含鋳造)
|
|---|
| Research Institution | Kumamoto University |
|---|
Principal Investigator |
HONDA Tadatoshi Kumamoto Univ., Professor, 工学部, 教授 (80040393)
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
MIURA Hideshi Kumamoto Univ., Assistant Professor, 工学部, 助教授 (30117254)
|
|---|
| Project Period (FY) |
1991 – 1992
|
| Keywords | Brazing / Bonding Strength / Filler Metal / Boride Ceramics / Interface / thermal Stress / Activated Metal |
|---|
| Research Abstract |
In this study, two kinds of boride base ceramics were used, and high speed steel was chosen as bonding partner because it has the lowest thermal expansion coefficient in the steel materials. As filler metal, Ag-Cu system alloys were used because of its low melting point and good wettability on steel material. Bonding strength was evaluated from shear test and bonding structure was investigated with EPMA.The results obtained from this experiment are summarized as follows: 1) Both TiB_2-TaB_2-CoB and TiB_2-Ti(C,N)-Mo_2NiB_2 ceramics showed good joinability with Ag-Cu system filler metals. 2) Three-foil filler metal which consist of Ag-Cu eutectic alloy and Ni or Ti, Hf produced high bonding strength over 100Mpa. 3) In the case of using active metal as foil, reaction layer was formed at the ceramic and steel interface including those elements and Cu, which seemed to be effective on the boning strength. 4) Using of Ag-Cu-Sn/Ti/Ag-Cu-Sn filler metal produced the bonding strength over 100MPa even at a low temperature of 973K.
|
