1993 Fiscal Year Final Research Report Summary
Diffusion Bonding of High Temperature Ceramic Superconductor
| Project/Area Number |
04452285
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| Research Category |
Grant-in-Aid for General Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
溶接工学
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
SUZUMURA Akio Tokyo Institute of Technology, Faculty of Engineering, Professor, 工学部, 教授 (80114875)
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| Co-Investigator(Kenkyū-buntansha) |
TAKAHASHI Kunio Tokyo Institute of Technology, Faculty of Engineering, Associate, 工学部, 助手 (70226827)
ONZAWA Tadao Tokyo Institute of Technology, Faculty of Engineering, Professor, 工学部, 教授 (10016438)
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| Project Period (FY) |
1992 – 1993
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| Keywords | Superconductor / Ceramics / Diffusion binding / Interlayr / Critical Temperature / Critical Current density / X-ray Diffraction / Differential Thermal Analysis |
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| Research Abstract |
Diffusion bond-ability of Y-Ba-Cu-O system high Tc superconductor using silver oxide as an interlayr material has been investigated by SEM/EPMA analysis, differential thermal analysis, X-ray diffraction tests and examination on superconducting behavior of the joints. Differential thermal analysis results showed that silver oxide added to the superconductor decomposed at about 350C.X-ray diffraction test results in the vicinity of the joints suggested that the silver oxide supplies oxygen to the joint area and contributes to maintain the superconductivity of the joint. X-ray diffraction results also showed that the thickness of the destroyed superconductive layr at the joint area was less than 0.3 mm from the bonded interface. These results demonstrate the possibility of diffusion bonding of high Tc ceramic superconductor without impairing the superconductivity by decompoising and diffusing the interlayr material into the base material.
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