1994 Fiscal Year Final Research Report Summary
Reactive Ion Beam Machining of Diamond Tools
| Project/Area Number |
05650126
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| Research Category |
Grant-in-Aid for General Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Research Field |
機械工作・生産工学
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| Research Institution | Science University of Toyko |
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Principal Investigator |
MIYAMOTO Iwao Science University of Tokyo Applied Electronics Associate Professor, 基礎工学部, 助教授 (10084477)
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| Project Period (FY) |
1993 – 1994
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| Keywords | Reactive ion beam / Diamond tool / Oxygen / Machining rate / Ion Energy / Ion incident angle / Radiation damage / Molecular dynamics |
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| Research Abstract |
In order to apply the reactive ion beam machining with oxygen and hydrogen ions to ultra-precision processing of diamond tools, the dependence of the machining rate of (100) face of diamond chips on the ion energy, ion incidence angle, the ion current density and the wotk-piece temparature during processing were mainly investigated. The machining rate for "reactive" oxygen ion beam machining which includes both physical sputtering and chemical etching is about ten times faster than that for ion beam machining using "inert" argon ions which causes only physical sputtering. Moreover, the surface roughness of the diamond chip after oxygen ion beam machining which was measured using Atomic Force Microscope is about six times smaller than that before machining.
From machining characteristics such as angular dependence of the machining rate and so on, it is concluded that machining mechanisum in the casehydrogen ions is physical sputtering without chemical reaction.
Molecular dynamics simulation of ion beam machining is usefull for understanding the radiation damage of single crystal diamond.
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