1995 Fiscal Year Final Research Report Summary
Research on Diamond Turning & Grinding in Low Temperature Machining Environment
| Project/Area Number |
06402031
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| Research Category |
Grant-in-Aid for General Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Research Field |
機械工作・生産工学
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| Research Institution | TOKYO INSTITUTE OF TECHNOLOGY |
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Principal Investigator |
ITO Yoshimi Tokyo Institute of Technology, Faculty of Engineering, Professor, 工学部, 教授 (60016441)
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| Co-Investigator(Kenkyū-buntansha) |
HASHIZUME Hitoshi Tokyo Institute of Technology, Faculty of Engineering, Research Associate, 工学部, 助手 (50218400)
INABA Chikao Tokyo Institute of Technology, Faculty of Engineering, Research Associate, 工学部, 助手 (10223231)
WARISAWA Shinichi Tokyo Institute of Technology, Precision & Intelligence Laboratory, Research Ass, 精密工学研究所, 助手 (20262321)
SHINNO Hidenori Tokyo Institute of Technology, Faculty of Engineering, Associate Professor, 工学部, 助教授 (40196639)
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| Project Period (FY) |
1994 – 1995
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| Keywords | Ultraprecision / Cutting / Diamond turning / Machining environment / Machine Tool / Low temperature machining / Hard-to-cut material / Ultra-fine machining |
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| Research Abstract |
In order to realize an ultraprecision machining technology of the future, we proposed an idea of the machining environment-controlled ultraprecision machining methodology and a design concept of the available ultraprecision machining system with diamond turning and ultraprecision grinding functions. And also, we carried out the detailed investigations on the proposed machining method and the development of a concrete machine system. As a result, the following conclusions can be obtained from a series of the research and development.
1. We could successfully developed an ultraprecision machining system for diamond turning and grinding with high performance to be effectively and rationally able to machine hard-to-cut materials.
2. We carried out rationally investigations on the machining method of titanium ally substrate, one of the hard-to-cut materials, and evaluated its proposed machining method. And we could ascertain applicability and availability of the proposed machining method.
3. We could clear the difference of tool wear and chipping condition, chip form and flow, surface roughness and profile of the machined surface when cutting the titanium ally substrate in the various machining environment. And based on the results, we proposed cutting mechanism of titanium ally in the ultraprecision cutting region, i.e., the depth of cut is nm orders.
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