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1997 Fiscal Year Final Research Report Summary

Micro-thermocompression Bonding Mechanism and Modeling for Electronics Devise Interconnection

Research Project

Project/Area Number 07455291
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Material processing/treatments
Research InstitutionOsaka University

Principal Investigator

TAKAHASHI Yasuo  Osaka University, Joining and Welding Research Institute, Associate Professor, 接合科学研究所, 助教授 (80144434)

Project Period (FY) 1995 – 1997
KeywordsThermocompression Bonding / Wire Bonding / Lead / Pad / Gold Wire / Finite Element Method / Numerical Analysis / Microjoining / Modeling
Research Abstract

Process mechanism of wire bonding and fine lead bonding used in pakaging of microelectronics was studed. Deformation processes during these thermocompression bonding without ultrasonic vabration are simulated by a numerical model which is based on the finite element technique. The growth process of interfacial contact between wire surface and lead frame is also analyzed. If the contact interface is fixed then the lateral wire surface expands simultaneously with folding to the lead frame, producing the perimeter bond. On the other hand, if the contact interface can slide, the center of contact area largely expands and the lateral wire surface does not extends. It follows that the interfacial contact area tends to be fixed but not to slide when the perimeter bond is produced even if strong metallic bond is not achieved at the center. The wire reduction greater than 0.5 is required for ensuring the strong perimeter bond formation. This is supported by the experimental rsults.The interfacial contact area is governed mainly by the wire reduction. If the reduction is kept constant then the tool with a groove increases the contact area somewhat larger than the flat tool, although the groove tool decreases the rate of wire deformation. We further discuss the size limit of wire bonding, taking into account the perimeter bonding mechanism.
With respect to lead bonding, effect of pad thickness and hardness on the interfacial deformation was investigated. In paticular, pad thickness effect largely change the interfacial deformation and the stress distribution on the interfaces between pad and lead andbetween pad and substrate. This was supported by experimental data.
Moreover, solid state micro room temperature bonding of fine golid wire was tried. Ultra high vacume condition and the bonding surface activated by ion beam make this bonding possible. We cannot ignor the elastic deformation around bond interface. The reduceing process of elastic stress distribution was modeled.

  • Research Products

    (10 results)

All Other

All Publications (10 results)

  • [Publications] Yasuo TAKAHASHI Sigeru Shibamoto Katsunori Inoue: "Numerical Analysis of the Interfacial Contact Process in Wire Thermocompression Bonding" IEEE Transaction, Components Packaging and Manufacturing Technol.PartA. 19,No.2. 213-223 (1996)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Yasuo TAKAHASHI Katsunori Inoue Mitsuyoshi TANIMOTO: "Effect of Surface Asperity Profile on Solid State Interfacial Adhering Process-Numerical Study of Solid State Bonding-" Proceeding of 2nd Symposium "Microjoing and Assembly Technology in Electronics". Vol.2. 53-58 (1996)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Yasuo TAKAHASHI Souta MATSUSAKA Katsunori INOUE: "Numerical Analysis of the Room Temperature Adhering Process of Au fine Wiles-Theoretical Idea to Reduce the Residual Stress on the Bond interface-" Proceeding of 3rd Symposium on "Microjoining and Assembly Technology in Electronics. Vol.3. 143-146 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE: "Numerical Analysis of Interfacial Deformation in Thermocompression Bonding" Proceeding of 3rd Symposium on "Microjoining and Assembly Technology in Electronics. Vol.3. 137-142 (1997)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE: "Numerical Analysis of Wire Bonding-Effect of Pad Thickness on Interfacial Defmation Behaviors-" Proceeding of 4th Symposium on "Microjoining and Assembly Technology in Electronics. Vol.4. 73-78 (1998)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Yasuo TAKAHASHI Sigeru SHIBAMOTO,Kaysunori INOUE: "Numerical Analysis of the Interfacial Contact Process in Wire Thermocompression Bonding" IEEE TRANS.Components Packaging and Manufactureing Technol.PartA. Vol.19, No.2. 213-223 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Yasuo TAKAHASHI Katsunori INOUE Mitsuyoshi TANIMOTO: "Effect of Surface Asperity Profile on Solid State Interfacial Adhering Process ---- Numerical Study of Solid State Bonding ----" 2nd Symposium "Microjoining and Assembly Technology in Electronics (Mate'96) Feb.1-2 (1996) Yokohama Proc.Vol.2. 53-58 (1996)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Yasuo TAKAHASHI Souta MATSUSAKA Katsunori INOUE: "Numerical Analysis of the Room Temperature Adhering Process of Au Fine Wires ----Theoretical Idea to Reduce the Residual Stress on the Bond-interface----" 3rd Symposium "Microjoining and Assembly Technology in Electronics (Mate'97) Feb.6-7 (1997) Yokohama Proc.Vol.3. 143-146 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE: "Numerical Analysis of Interfacial Deformation in Thermocompression Bonding" 3rd Symposium "Microjoining and Assembly Technology in Electronics (Mate'97) Feb.6-7 (1997) Yokohama Proc.Vol.3. 137-142 (1997)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Yasuo TAKAHASHI Michinobu INOUE Katsunori INOUE: "Numerical Analysis of Wire Bonding -----Effect of Pad Thickness on Interfacial Deformation Behaviors-----" 4th Symposium "Microjoining and Assembly Technology in Electronics (Mate'98) Jan..29-30 (1998) Yokohama Proc.Vol.4. 73-78 (1998)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 1999-03-16  

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