1996 Fiscal Year Final Research Report Summary
Development of Temperature Measurement Method in Micro-Scale Region by using Atomic Force Microscope.
| Project/Area Number |
07555069
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| Research Category |
Grant-in-Aid for Scientific Research (A)
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| Allocation Type | Single-year Grants |
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| Section | 試験 |
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| Research Field |
Thermal engineering
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
HIJIKATA Kunio Tokyo Institute of Technology, Department of Mechano-Aerospace Engineering, Professor, 工学部, 教授 (60016582)
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| Co-Investigator(Kenkyū-buntansha) |
HIRASAWA Shigeki Hitachi Ltd.Mechanical Engineering Research Laboratory, Senior Researcher, 機械研究所, 主任研究員
NAKABEPPU Osamu The University of Tokyo, Department of Engineering, Research Associate, 大学院工学系研究科, 助手 (50227873)
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| Project Period (FY) |
1995 – 1996
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| Keywords | Atomic Force Microscope / Temperature Measurement / Thermal Properties / Point Contact / micro-thermocouple / Heat Transfer |
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| Research Abstract |
With a remarkable progress in science and technology, to make clear heat transfer characteristics in a microscopic scale is becoming great important issue. The purpose of this study is to develop a new technique for a micro-scale thermal measurement with AFM (Atomic Force Microscope) Which exceeds ordinary small scale temperature measurement techniques.
In the project, special thermocouple (T.C.) probes and electric conductive probes were made as a cantilever for AFM.The T.C.probe composed of 25 micrometer sharpen nickel wire and 30 nano-meter gold deposition film has a junction of about 5 micrometer at a tip of the probe. The electric probe has same structure as the T.C.probe and made of gold wire and gold film.
By making point contact between the probes and conductive sample or heated nonconductive sample, the contact condition has been clarified, such as contact radius, deformation mode and electron transport mode. Electric and thermal measurement of the point contact condition indicates the contact radius of about 10 nano-meter and a few nano-meter, respectively. These small contact scale has possibility of accomplishing thermal measurement with high spatial resolution.
By scanning the T.C.probe on tiny heated sample, temperature distribution with 30 micrometer and a few micrometer resolution were sttained in 760 Torr and 0.02 Torr atmosphere. Since heat transfer through the contacting point is much smaller than that throughair, low pressure condition leads small thermal signal. For measurement with higher resolution it is important to reduce the T.C.junction size.
The thermal measurement technique was applied to measure physical properties of a composite material sample of a Carbon Fiber Reinforced Plastic (CFRP) composed of epoxy resin and carbon fiber. By selecting suitable thickness of the sample, clear contrast of both electrical and thermal conductivity of the different materials was measured with sub-micron scale under vacuum condition.
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Research Products
(4 results)
