1998 Fiscal Year Final Research Report Summary
Study on Development and Application of Intelligent Structure with Smart Materials
| Project/Area Number |
08045029
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| Research Category |
Grant-in-Aid for international Scientific Research
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| Allocation Type | Single-year Grants |
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| Section | University-to-University Cooperative Research |
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| Research Field |
Dynamics/Control
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| Research Institution | TOHOKU UNIVERSITY |
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Principal Investigator |
CHONAN Seiji Tohoku Univ., Mechatronics and Precision, Professor, 大学院・工学研究科, 教授 (20005424)
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| Co-Investigator(Kenkyū-buntansha) |
TANAKA Mami Tohoku Univ., Mechatronics and Precision, Research Assoc., 大学院・工学研究科, 助手 (80271873)
裘 進浩 東北大学, 流体科学研究所, 講師 (60241585)
TAKAGI Toshiyuki Tohoku Univ., Institution of Fluid and Science, Professor, 流体科学研究所, 教授 (20197065)
TANI Junji Tohoku Univ., Institution of Fluid and Science, Professor, 流体科学研究所, 教授 (30006192)
JIANG Zhongwei Tohoku Univ., Mechatronics and Precision, Assoc.Professor, 大学院・工学研究科, 助教授 (60225357)
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| Project Period (FY) |
1996 – 1998
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| Keywords | Piezoactuator / Piezosensor / Optimum Design / Structural Health Monitoring / Measuring & Monitoring Sys / Data Processing |
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| Research Abstract |
The purpose of this project is to development a practical and quantitative structural health monitoring technique for intelligent structure system. Since the piezoelectric actuator can be driven at very high frequency and the piezoelectric sensor is very sensitive to the rate of strain changes, the piezoceramic patches structures were introduced as actuators and sensors to generate and receive a high frequency wave propagating in the structure. Since the electromechanical coupling between the piezoelectric material and the structure the physical changes in the structure can be captured efficiently by monitoring the PZT electric impedance this technique is very sensitive to detect the presence of incipient-type damage such as small cracks or loose connections. Furthermore an advanced technique for assessment of the location and characterization of damages by measuring longitudinal wave propagation was developed. In order to reduce the numbers of the PZT patches in the structure for cuffing down the cost of wiring, the technique how to reducing piezoelectric patches in the structure was also investigated. The obtained results have been presented at the SPIE's 6th Annual International Symposium on Smart Structures and Materials.
Further, a real time cutting condition monitoring system on slicing 300mm silicon ingot was also developed because the silicon ingot should be cut to yield wafers surface as flat and smooth as possible. The circumferential, radial and normal cutting forces were measured by using the piezoelectric 3-axis load sensor fixed onto the mount of the silicon ingot. The results show that the cuffing condition of the saw blade is clearly predicted by analyzing the high-frequency signal with FFT and wavelet transforms, and the on-line monitoring system is validated experimentally useful for evaluation of 300mm silicon ingot slicing machine.
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