1997 Fiscal Year Final Research Report Summary
Development of High Performance Ti Alloy Composite by Controlling Microstructure and Inter face.
Project/Area Number |
08555023
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Research Category |
Grant-in-Aid for Scientific Research (B)
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Allocation Type | Single-year Grants |
Section | 展開研究 |
Research Field |
Materials/Mechanics of materials
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Research Institution | Nagaoka University of Technology |
Principal Investigator |
OKAZAKI Masakazu Nagaoka Univershity of Technology, Dept.Mech.Eng., Associate Professor, 工学部, 助教授 (00134974)
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Project Period (FY) |
1996 – 1997
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Keywords | High performance Ti alloy composite / Diffuison bonding / Ti-24Al-11Nb / SiC / Thermal fatigue / Damage mechanism / Interfacial shear strength / Push-out test / composite |
Research Abstract |
Future aerospace structures require advanced materials with high specific strength and stiffness at elevated temperatures. In this study, development of high performance Ti alloy and composite has been studied, by controlling microstructures and interface. The main conclusion reached are summarized as follows : (1) A new concept to develop high performance Ti alloy and composite was proposed and studied, by controlling microstructures and interface. (2) The followings have been clarified on the thermal fatigue of an unidirectional SiC fiber rein-forced Ti-24Al-11Nb (at%) matrix composite : (i) outline on visible cracks induced by thermal fatigue, (ii) change of the cracks in density with thermal cycling, (iii) change of the fiber/matrix interface subjected to the thermal cycling, compared with that subjected to long term isothermal exposure, by means of EPMA and SEM, (iv) change of elastic properties and that of the resistance to stable crack growth resulting from thermal fatigue damage, (v) change of the interfacial shear strength on the basis of push-out tests, (vi) effect of environment on the properties from (i) to (v). (3) Summarizing the above systematic investigations, mechanisms and mechanics of thermal fatigue failure have been clarified and proposed.
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