| Co-Investigator(Kenkyū-buntansha) |
KOSAKA Akio Toyama University, Faculty of Engineering, Assistant, 工学部, 助手 (20242480)
HIRASAWA Yoshio Toyama University, Faculty of Engineering, Associate Professor, 工学部, 助教授 (80115146)
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| Research Abstract |
As the property required for heat sink materials in the field of semiconductor. VLSI and power transistor so on, it is important that the thermal expansion coefficient is approximated to that of a semiconductor chip and a package material. In addition, the high thermal conductivity is required.
In this study, the authors paid attention to metal composites consisting of copper (Cu) and molybdenum (Mo), and made the Cu-Mo composites of particle mixture type (M/CM) and laminated type (L/CM), In the composites of this two types, several measurement specimens whose the composition ratio of Cu and Mo was changed were prepared, respectively, and their thermophysical and mechanical properties were investigated. A thermal diffusivity, specific heat and thermal conductivity in the thermophysical properties were measured by the laser flash method in the range of room temperature to 800ﾟC and a thermal expansion coefficient was measured with the push-rod dilatometer in the range of 30-800ﾟC.As the mechanical properties, a tensile strength, elongation, Young' s modulus, Poissons ratio, Erichson value and Vickers hardness were mea- sured at room temperature. On the other hand, the theoretical equations for these thermophysical and mechanical properties were examined and compared with the experimental values.
As a result, the thermal expansion coefficient and the thermal conductivity of both Cu-Mo composites of M/CM and L/CM were controlled in the range of 5-17X10-6/K and 150-390W/(m-K) by changing the ratio of Cu and Mo, respectively, and it was found that these composites were able to the application of a heat sink material for the semiconductor chip so on.
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