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1999 Fiscal Year Final Research Report Summary

COMPUTER SIMULATIONS OF EMERGENT PROCESS IN CUTTING

Research Project

Project/Area Number 10650113
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field 機械工作・生産工学
Research InstitutionNAGOYA INSTITUTE OF TECHNOLOGY

Principal Investigator

INAMURA Toyohiro  NAGOYA INSTITUTE OF TECHNOLOGY, DEPARTMENT OF SYSTEMS ENGINEERING, PROFESSOR, 工学部, 教授 (60107539)

Co-Investigator(Kenkyū-buntansha) TAKEZAWA Nobuhiro  NAGOYA INSTITUTE OF TECHNOLOGY, DEPARTMENT OF SYSTEMS ENGINEERING, RESEARCH ASSOCIATE, 工学部, 助手 (50236452)
Project Period (FY) 1998 – 1999
KeywordsRENORMALIZATION / MOLECULAR DYNAMICS / BRITTLE / CUTTING / SIMULATION / DEFECTS / DUCTILE / 延性
Research Abstract

Based on the discussion in which the defect as a source of cracks must be created during cutting a silicon monocrystal, the renormalization group molecular dynamics has been proposed to simulate the defect initiation process. The method can be applied to a model of micrometer size, which is necessary to bring about brittle mode cutting, and yet permit the observations of the defect initiation process of an atomic size. The result of the simulation shows that a microcrack-like defect can be initiated during cutting through the interaction between local static stress distribution and global dynamic stress associated with acoustic waves.

  • Research Products

    (10 results)

All Other

All Publications (10 results)

  • [Publications] 尾形英之、武澤伸浩、稲村豊四郎: "繰り込み群分子動力学によるシリコン単結晶切削時の欠陥生成プロセス解析"精密工学会誌. 64巻10号. 1482-1486 (1998)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Inamura et al.: "Crack initiation in machining monocrystal silicon"Annals of the CIRP. Vol.48, No.1. 81-84 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] S. Shimada, T. Inamura, et al.: "Thermal Aspect of Micro to Nano Scale Metal Cutting"Proceedings from ASPE 1998 Annual Meeting. 116-119 (1998)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] N. Takezawa, T. Inamura, et al.: "Simulation of Wear Process on Tool Rake Face by RGMD"Proceedings of the 9th ICPE. 989-994 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] S. Shimada, T. Inamura, et al.: "Suppression of Tool Wear in Diamond Turning of Copper under Reduced Oxygen Atmosphere"Annals of the CIRP. Vol.49, No.1. (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] H. Ogata, N. Takezawa and T. Inamura: "Analysis of Defect Initiation Process in Maching Monocrystal Silicon Using Renormalization Group Molecular Dynamics"J. of JSPE. 64/10. 1482-1486 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] S. Shimada, T. Inamura et al.: "Thermal Aspect of Micro to Nano Scale Metal Cutting"Proc. of ASPE. 1998 meeting. 116-119 (1998)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Inamura et al.: "Crack Initiation in Machining Monocrystalline Silicon"Annals of the CIRP. 48/1. 81-84 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] N. Takezawa, T. Inamura et al.: "Simulation of Wear Process on Tool Rake Face by Renormalization Group Molecular Dynamics"Proc. of the 9th ICPE. 989-994 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] S. Shimada, T. Inamura et al.: "Suppression of Wear in Diamond Turning of Copper under Reduced Oxygen Atmosphere"Annals of the CIRP. 49/1 (to appear). (2000)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 2001-10-23  

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