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2001 Fiscal Year Final Research Report Summary

Interface Control of Nanoporous/Organic Low-k Dielectrics and Metal Electrode

Research Project

Project/Area Number 11450126
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field Electronic materials/Electric materials
Research InstitutionHIROSHIMA UNIVERSITY

Principal Investigator

KIKKAWA Takamaro  Research Center for Nanodevices and Systems, HIROSHIMA UNIVERSITY, Professor, ナノデバイス・システム研究センター, 教授 (60304458)

Co-Investigator(Kenkyū-buntansha) SHIBAHARA Kentaro  Research Center for Nanodevices and Systems, HIROSHIMA UNIVERSITY, Associate Professor, ナノデバイス・システム研究センター, 助教授 (50274139)
YOKOYAMA Shin  Research Center for Nanodevices and Systems, HIROSHIMA UNIVERSITY, Professor, ナノデバイス・システム研究センター, 教授 (80144880)
Project Period (FY) 1999 – 2001
KeywordsCu Ion / Porous MSQ / methylpolysilazane / methylsilsesquioxane / Low-k / ion-drift velocity / capacitor / Pool e-Frenkel current
Research Abstract

The purpose of this research is to investigate the interface reaction between porous low-k interlayer dielectric films derived from organic and inorganic precursors. As a consequence, a new interlayer dielectric film which can suppress Cu ion drift is formed. In order to study the mechanism of Cu ion drift in low-k dielectric films, capacitors with Cu electrodes were fabricated on low-k dielectric films and bias-temperature stress tests were carried out so that the flat band voltage shifts of the capacitors could be measured as ionic charges drifted under the electric fields.
Two kinds of precursors were prepared. One was a normal methylpolysilazane (Si_x(NH)_y CH_3) and the other was a porous methylpolysilazane in which a porogen was incorporated, where Si-NH bonds turned to Si-O-Si bonds, while Si-CH_3 bonds stayed constant. A porogen was remained in the film after the pre-bake and H_2O absorption steps and vanished after 400℃ cure step due to evaporation, resulting in the formation o … More f porous rnethylsilsesquioxane film.
Capacitance-Voltage characteristics of the normal and porous methylsilsesquioxane/SiO_2-substrate capacitors with Cu electrodes were measured before and after 200℃ and 0.1 MV/cm bias-temperature stress for 2 hours. The dielectric constants of the normal and porous rnethylsilsesquioxane films were 2.7 and 2.2, respectively. Flatvband voltage shifts after bias temperature stresses for the normal and porous methylsilsesquioxane/SiO_2/Si capacitors with Cu electrodes were 1.183 and 0.204 V, respectively. It is found that the less negative flatband voltage shift was observed for the porous methylsilsesquioxane film than for the normal film.
Results from Arrehnius plots of Cu ion drift velocity for porous and normal films indicated that Cu ion drift velocity in the porous film was lower than that in the normal film and the activation energies of Cu ion drift velocity were in the range of 1.0-1.1ev.
lt was found that porous methylsilsesquioxane (MSQ) derived from methylpolysilazane (MSZ) showed inprovement of Cu ion drift suppression by a order of magnitude. Furthermore, Cu ion drift caused defects in porous MSQ so that Poole-Frenkel leakage current increased, resulting in decrease of dielectric breakdown life time. Less

  • Research Products

    (24 results)

All Other

All Publications (24 results)

  • [Publications] 吉川公麿: "「ULSIの微細化と多層配線技術への課題」"応用物理(応用物理学会). 第68巻 第11号. 1215-1225 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 吉川公麿: "「多層配線技術とスケーリング」"電子情報通信学会論文誌C(電子情報通信学会). Vol.J83-C No.2. 105-117 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "Direct patterning of photosensitive low-dielectric-constant films using electron beam lithography"Appl. Phys. Lett.. Vol.78, No.17. 2557-2559 (2001)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] S.Mukaigawa: "Measurement of Copper Drift in Methylsilsesquiazne-Methylsilsesquioxane Dielectric Films"Jpn. J. Appl, Phys. Part I, (2000). No.4B, Vol.39. 2189-2193 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "Present status and future trend of low-k dielectrics/interconnect technologies for ULSI"Proc. 2002 7th International Syposium on Plasma-and Process-Induced Damage. 154-157 (2002)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "Current and Future Low-k/Cu Interconnect Technologies for ULSIs (Invited)"Proc. Workshop on Frontiers in Electronics, (IEEE, St. Croix, Jan. 6-11,2002). 25 (2002)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "A photosensitive low-k interlayer-dielectric film for ULSIs (Invited)"Proc. International Conference on Solid-State and Integrated Circuit Technology. 348-351 (2001)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "Copper drift in porous methylsilsesquiazane low-k dielectric films"Proc. 30^<th> European Solid-State Devices Research Conference. 208-211 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "Current and Future Low-k Dielectrics for Cu Interconnect"Technical Digest of International Eelectron Devices Meeting (IEEE, New York, 2000). 253-256 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] T.Kikkawa: "ULSI Scaling and Interconnect Technology"Proceedings of the Advanced Metallization Conference (Materials Research Society, Wsarrendale, PA, 1999). 705-715 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] S.Mukaigawa: "Measurement of Copper Drift in Methylsilsesquioxane Dielectric Films"Proceedings of International Conference on Solid-State Devices and Materials (Japan Society of Applied Physice, Tokyo, 1999). 504-505 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] S.Mukaigawa: "Copper Ion Drift in Porous Methylsilsesquiazane Dielectric Films"Tended Abstracts of SSDM, (Japan Society of Applied Phys., Tokyo). 34-35 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Takamaro Kikkawa: "Recent Progress in ULSI Sealing and Multilevel Interconnect Technology"Ohyobutsuri (Japan Society of Applied Physics). Vol.68, No.11. 1215-1225 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Takamaro Kikkawa: "Multilevel Interconnect and Scailing"Institute of Electronic Communication and Information, Journal C (IECEI). Vol.J83-C, No.2. 105-117 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "Direct pattering of photosensitive low dielectric constant films using electron-beam lithography"Applied Physics Letters. Vol.78, No.17. 2557-2559 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] S. Mukaigawa: "Measurement of Copper Drift in Methylsilsesquiazane-Methylsilsesquioxane Dielectric Films"Jpn. J. Appl. Phys. Part I. No.4B, Vol.39. 2189-2193 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "Present status and future trend of low-k dielectrics/interconnect technologies for ULSI"Proc. 2002 7th International Syposium on Plasma and Process Induced Damage, (American Vaccum Society, IEEE, Maui, USA, June 6-7. 154-157 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "Current and Future Low-k/Cu Interconnect Technologies for ULSIs (Invited)"Proc. Workshop on Frontiers in Electronics, (IEEE, St. Croix, Jan. 6-11). 25 (2002)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "A photosensitive low-k interlayer-dielectric film for ULSIs (Invited)"Proc. International Conference on Solid-State and Integrated Circuit Technology, (Chinese Institute of Electronics, Shanghai, Oct. 22-25). 348-351 (2001)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "Copper drift in porous methylsilsesquiazane low-k dielectric films"Proc. 30th European Solid-State Devices Research Conference (Ireland's Information and Communication Technologies research Centre, Cork, Ireland, Sept. 11-13). 208-211 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "Current and Future Low-k Dielectrics for Cu Interconnect"Technical Digest of International Eelectron Devices Meeting, (IEEE, New York). 253-256 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] T. Kikkawa: "ULSI Scaling and Interconnect Technology"Proceedings of the Advanced Metallization Conference (Materials Research Society, Wsarrendale, PA). 705-715 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] S. Mukaigawa: "Measurement of Copper Drift in Methylsilsesquioxane Dielectric Films"Proceedings of International Conference on solid-State Devices and Materials (Japan Society of Applied Physics, Tokyo). 504-505 (1999)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] S. Mukaigawa: "Copper Ion Drift in Porous Methylsilsesquiazane Dielectric Films"Extended Abstracts of SSDM, (Japan Society of Applied Phys., Tokyo). 34-35 (2000)

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 2003-09-17  

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