• Search Research Projects
  • Search Researchers
  • How to Use
  1. Back to project page

2000 Fiscal Year Final Research Report Summary

Constitutive relations of thermosetting resin during curing process and their applications of estimating internal stresses

Research Project

Project/Area Number 11650079
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeSingle-year Grants
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionTokyo Denki University (2000)
Tokyo Institute of Technology (1999)

Principal Investigator

IKEGAMI Kozo  Tokyo Denki University, Department of Mechanical Engineering, Professor, 工学部, 教授 (40016788)

Co-Investigator(Kenkyū-buntansha) SATO Chiaki  Tokyo Institute of Technology, Precision and Intelligence Laboratory, Associate Professor, 精密工学研究所, 助教授 (80235366)
Project Period (FY) 1999 – 2000
KeywordsThermosetting resin / Phase transition / Constitutive relations / Internal stress / Viscoelastic deformation / Curing process
Research Abstract

Constitutive relations of thermosetting resin during curing process were formulated on the basis of experimental results of viscoelastic deformation and volume shrinkage for various temperature conditions. Internal stress of resin models induced by curing process were analyzed using formulated constitutive relations.
1. Material properties of thermosetting resin during curing process
(1) Volume shrinkages were experimentally measured during curing process under various temperature conditions.
(2) High temperature curing resulted in rapid and large shrinkage.
2. Constitutive relations of thermosetting resin during curing process
(1) Creep deformations were experimentally measured during curing processes under various temperature conditions.
(2) Experimental creep deformations were formulated by using non-linear viscoelastic models.
3. Estimation of internal stress of resin models
(1) Large internal stresses were induced by high temperature curing for two-layered composite models of the resin and metal plate.
(2) Viscoelastic analysis gave better results than elastic analysis for the estimation of thermal deformation of the model.
(3) Non-uniform temperature distribution induced large internal stresses for the resin n block of molding cavity comparing uniform temperature conditions.

  • Research Products

    (9 results)

All Other

All Publications (9 results)

  • [Publications] 仁内宏紀,佐藤千明,池上皓三: "熱硬化性樹脂の変動温度下での硬化過程に於ける体積変動率"材料. 48巻6号. 643-648 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Kozo Ikegami,Hiroshi Kawada: "Internal stresses of epoxy resin induced b thermal history"Proceedings of the third international congress on thermal stresses. 203-206 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Kozo Ikegami,Hiroaki Matsui: "Evolution of internal stress of thermosetting resin during curing process"Proceedings of the first international workshop on electronics Materials and packaging. 153-158 (1999)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Kozo Ikegami: "Internal stress of thermosetting resin induced by curing process"Prceedings of the forty fifth congress of the Indian society of theoretical and applied mechanics. 1-8 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] 宮入裕夫,中前勝彦,天野晋夫,池上皓三,笠野秀秋,越智光一: "先端接着接合技術"エヌジーテイー. 775 (2000)

    • Description
      「研究成果報告書概要(和文)」より
  • [Publications] Hiroki NIUCHI, Chiaki SATO, Kozo IKEGAMI: "Volume change of thermosetting resin during curing process under variable temperatures"Journal of the Society of Materials Science, Japan. Vol.48, No.6. 643-648 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Kozo IKEGAMI, Hiroshi KAWADA: "Internal stress of epoxy resin induced by thermal history"Proceedings of the Third International Congress on Thermal Stress. 203-206 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Kozo IKEGAMI, Hiroyuki MATSUI: "Evolution of internal stress of thermosetting resin during curing process"Proceedings of the First International Workshop on Electronics Materials and Packaging. 153-158 (2000)

    • Description
      「研究成果報告書概要(欧文)」より
  • [Publications] Kozo IKEGAMI: "Internal stress of thermosetting resin induced by curing process"Proceedings of the Forty Fifth Congress of the Indian Society of Theoretical and Applied Mechanics. 1-8 (2000)

    • Description
      「研究成果報告書概要(欧文)」より

URL: 

Published: 2002-03-26  

Information User Guide FAQ News Terms of Use Attribution of KAKENHI

Powered by NII kakenhi