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2001 Fiscal Year Final Research Report Summary

Development of fixed abrasive tools utilizing sol-gel method

Research Project

Project/Area Number 12450055
Research Category

Grant-in-Aid for Scientific Research (B)

Allocation TypeSingle-year Grants
Section一般
Research Field 機械工作・生産工学
Research InstitutionThe University of Tokyo

Principal Investigator

TANI Yasuhiro  The University of Tokyo, Institute of Industrial Science, Professor, 生産技術研究所, 教授 (80143527)

Co-Investigator(Kenkyū-buntansha) KAWATA Kenji  Taiho Industrial Co.Ltd., Chief Researcher, 中央研究所, 主任研究員
YANAGIHARA Kiyoshi  The University of Tokyo, Institute of Industrial Science, 生産技術研究所, 助手 (90313113)
Project Period (FY) 2000 – 2001
KeywordsPolishing / High-Performance abrasive / Sol-Gel method / Agglomerative abrasive grain / Fixed-Abrasive tool / Loose abrasive tool
Research Abstract

Conventional vitrified grinding stones are manufactured utilizing by dry-state molding method so that homogeneity in dispersion of abrasives deteriorates when fine abrasives are used. Then sol-gel method was applied to manufacture grinding stones, which enabled production of homogeneous porous structure even if fine abrasives were used. As the result it was made clear that the sol-gel method was suitable for manufacturing of bridge-structured grinding stones with fine abrasives and the stone structure could be changed with composition of the starting solution. The hardness of the stones was changed by baking temperature with no change of the structure. Mirror finish of 25nmRy was accomplished using a GC#10000 stone in infeed grinding of a silicon wafer.

  • Research Products

    (2 results)

All 2001

All Journal Article (2 results)

  • [Journal Article] Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer2001

    • Author(s)
      T.Enomoto, Y.Tani, K.Orii
    • Journal Title

      Proc. ICPE2001

      Pages: 391-395

    • Description
      「研究成果報告書概要(和文)」より
  • [Journal Article] Development of a Lapping Film Utilizing Agglomerative Superfine Silica Abrasives for Edge Finishing of a Silicon Wafer2001

    • Author(s)
      T.Enomoto, Y.Tani, K.Orii
    • Journal Title

      Proc.ICPE2001

      Pages: 391-395

    • Description
      「研究成果報告書概要(欧文)」より

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Published: 2007-12-13  

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