2003 Fiscal Year Annual Research Report

鉛フリーはんだ実装における凝固欠陥の抑制技術開発

Research Project

Project/Area Number	13355029
Research Institution	OSAKA UNIVERSITY
Principal Investigator	菅沼克昭大阪大学, 産業科学研究所, 教授 (10154444)
Co-Investigator(Kenkyū-buntansha)	末次憲一郎松下電器株式会社, 生産技術本部, 主幹技師(研究職) 井上雅博大阪大学, 産業科学研究所, 助手 (60291449) 奥健夫大阪大学, 産業科学研究所, 助教授 (30221849)
Keywords	鉛フリー / 凝固 / その場観察 / シミュレーション / 界面 / TEM / 偏析
Research Abstract	Sn-Ag-Cu鉛フリーはんだを用い,ICリードのミクロ接続部分における凝固現象のその場観察を始めて実現し,同時に凝固シミュレーションにより凝固のプロセスを明らかにした.形成されたはんだフィレットの組織観察から,凝固シミュレーションの正確さが検証された.ICリード材質がはんだの凝固速度へ与える影響を計算により明らかにし,さらにその場観察とはんだフィレット組織との対応を証明した.その結果は,はんだ組織の微細化には熱伝導に優れるCu配線がFe系の配線より有利であることを明らかにした.また,凝固最終部分の予測を可能にし,偏析や欠陥の生じる原因と場所の特定を始めて可能にした. 一方,はんだ接続界面のTEMによるナノ構造観察と合金制御による最適化を行い,付加価値の高いNi-Pめっき/Sn合金界面における反応プロセスを解明した.これによって,信頼性の劣化につながる界面反応-Pリッチ層の形成のメカニズムを突き止め,Niがめっき中からはんだ液相へ著しく拡散するためNi不足の層が生じ,Ni_3Sn_4/Ni_3SnP化合物とPリッチ層が形成されることをTEM観察を中心に明らかにした.この反応抑制には,はんだにCuを添加することで界面反応にCuがNiより先に関与するため,(Cu,Ni)_6Sn_5化合物が形成され,これによってNi拡散が抑制され,最終的に界面の信頼性向上が可能になることを示した. これらの成果は,はんだ接続の科学的基礎を築き,ミクロ接続領域の高信頼性化のための各種組織制御が可能になることを示したものとして,国際的に注目を集めている.

Research Products
(31 results)

All Other

All Publications (31 results)

[Publications] K.S.Kim, S.H.Huh, K.Suganuma: "Effect of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints"J.Alloys Compounds. 352・1-2. 226-236 (2003)
[Publications] K.S.Kim, S.H.Huh, K.Suganuma: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu"Microelectronics Reliability. 43・2. 259-267 (2003)
[Publications] 菅沼克昭, 酒井泰治, 金槿銖: "Sn-Bi共晶合金の組織及び機械的性質へ及ぼすAg添加の影響"エレクトロニクス実装学会誌. 6・5. 414-419 (2003)
[Publications] K.S.Kim, K.Suganuma, T.Shimozuki, C.G.Lee: "Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered joints"Mater.Sci.Forum. 439・1. 7-11 (2003)
[Publications] C.W.Hwang, K.S.Kim, K.Suganuma: "Interfaces in lead-free soldering"J.Electron.Mater. 32・11. 1249-1256 (2003)
[Publications] E.Saiz, C.-W.Hwang, K.Suganuma, A.P.Tomsia: "Spreading of Sn-Ag solders on Fe-Ni alloys"Acta Mater. 51・11. 3185-3197 (2003)
[Publications] K.S.KIM, M.Haga, K.Suganuma: "In-Situ Observation and Simulation of the Solidification Process in Soldering a Small Outline Package with the Sn-Ag-Cu Lead-Free Alloy"J.Electron.Mater. 32・12. 1483-1489 (2003)
[Publications] C.W.Hwang, K.Suganuma: "Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders"J.Mater.Res.. 18・11. 2540-2543 (2003)
[Publications] C.W.Hwang, K.Suganuma: "Effects of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42 Ni"Materials Transaction. 45・3. 716-722 (2004)
[Publications] C.W.Hwang, K.Suganuma: "Joint reliability and high temperature stability of Sn-Ag-Bi lead-free solder with Cu and Sn-Pb/Ni/Cu substrates"Materials Science & Engineering A. (in press). (2004)
[Publications] M.Haga, K.S.Kim, K.Suganuma: "In situ observation and simulation of solidification process in soldering SOP with Sn-Ag-Cu Lead-Free Alloy"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 261 (2003)
[Publications] C.W.Hwang, J.G.Lee, H.Mori, K.Suganuma: "Interface microstructure between 42 alloy and Sn-based lead-free solder"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 305 (2003)
[Publications] C.W.Hwang, K.S.Kim, K.Suganuma: "Interfaces in lead-free soldering (invited)"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 316 (2003)
[Publications] M.Inoue, K.Suganuma: "Analysis of surface reaction behavior for generating atomic hydrogen on Ni_3Al surfaces"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 455 (2003)
[Publications] Y.S.Kim, C.W.Hwang, K.Suganuma: "Solderability and Interface Property of Sn-Zn-Bi on Metal Substrates"International Conference on Electronics Packaging(ICEP2003), JEEP, Tokyo. (Proceedings). 345-348 (2003)
[Publications] C.W.Hwang, K.Suganuma: "Interfacial Reaction of Sn-based Lead-free Solder with Fe-42Ni Substrate"International Conference on Electronics Packaging(ICEP2003), JIEP, Tokyo. (Proceedings). 360-365 (2003)
[Publications] K.Suganuma, T.Kiga, M.Takeuchi, et al.: "Current Technology of Low Temperature Lead-Free Soldering and JIEP Project"International Conference on Lead Free Electronics "Towards Imprementation of the RHS Directive", IPC/Soldertech, Brussels. (Proceedings). 97-104 (2003)
[Publications] K.Suganuma, C.W.Hwang, M.Kiso, S.Hashimoto: "Interfacial stability of Sn-Ag-Cu lead-free solder with Ni-P alloy plating"Interl Technology Symposium, "Sesigning for next generation Computing Platforms", San Jose. (Proceedings). 18 (2003)
[Publications] K.S.Kim, K.Suganuma, M.Ueshima: "Development of New Lead-Free Solder Containing Nano Sized Particles"2004 TMS ANNUAL MEETING, Charlotte. (program). 22 (2004)
[Publications] K.Suganuma, K.S.Kim, C.W.Hwang: "Solidification Phenomenon in CSP Soldering with Sn-Ag-Cu Lead-Free Alloy Using In Situ Observation System with Computer Simulation(invited)"2004 TMS ANNUAL MEETING, Charlotte. (program). 23 (2004)
[Publications] C.W.Hwang, K.Suganuma, M.Kiso, S.Hashimoto: "Differences in Formation and Growth of Interface Between Sn-Ag and Sn-Ag-Cu Lead-Free Solder with Ni-P/Au Plating(invited)"2004 TMS ANNUAL MEETING, Charlotte. (program). 172 (2004)
[Publications] 菅沼克昭: "欧州の環境規制と世界の実用化に向けた鉛フリーはんだの技術動向"電子材料「実装技術ガイドブック2003年」. 5月号別冊. 2-10 (2003)
[Publications] 菅沼克昭: "鉛フリー化とハロゲンフリー化の基礎知識と最新研究開発動向"電子技術「2003年版プリント配線板のすべて」. 6月号別冊. 16-21 (2003)
[Publications] 菅沼克昭: "鉛フリーはんだ実用をめぐる欧州規制と技術の現状"金属. 73. 40-51 (2003)
[Publications] 菅沼克昭: "鉛フリー化から先進実装へ進化する接着剤技術"日立化成テクニカルレポート. 41. 5-6 (2003)
[Publications] 菅沼克昭: "低温鉛フリーはんだの位置づけと市場意識"エレクトロニクス実装学会誌. 6・5. 369-374 (2003)
[Publications] K.Suganuma: "Current status of lead-free soldering"SMT China. Nov/Dec. 42-49 (2003)
[Publications] 菅沼克昭, 黄致元: "鉛フリーはんだとNiめっき界面反応と組織"Uyemura Technical Report. 55. 3-12 (2004)
[Publications] 菅沼克昭: "鉛フリーはんだ実装技術-基礎からリフトオフ対策まで- (分担執筆)"コロナ社. 293 (2003)
[Publications] 菅沼克昭: "鉛フリーはんだ付け技術(分担執筆)"環境材料研究会編,工業調査会. 188 (2003)
[Publications] K.Suganuma: "Lead-Free Soldering in Electronics (編著)"Marcel Dekker, Inc. 376 (2003)

2003 Fiscal Year Annual Research Report

鉛フリーはんだ実装における凝固欠陥の抑制技術開発

Principal Investigator

菅沼 克昭 大阪大学, 産業科学研究所, 教授 (10154444)

Research Products

[Publications] K.S.Kim, S.H.Huh, K.Suganuma: "Effect of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints"J.Alloys Compounds. 352・1-2. 226-236 (2003)

[Publications] K.S.Kim, S.H.Huh, K.Suganuma: "Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu"Microelectronics Reliability. 43・2. 259-267 (2003)

[Publications] 菅沼克昭, 酒井泰治, 金 槿銖: "Sn-Bi共晶合金の組織及び機械的性質へ及ぼすAg添加の影響"エレクトロニクス実装学会誌. 6・5. 414-419 (2003)

[Publications] K.S.Kim, K.Suganuma, T.Shimozuki, C.G.Lee: "Effects of fourth alloying additives on interfacial microstructure of Sn-Ag-Cu lead-free soldered joints"Mater.Sci.Forum. 439・1. 7-11 (2003)

[Publications] C.W.Hwang, K.S.Kim, K.Suganuma: "Interfaces in lead-free soldering"J.Electron.Mater. 32・11. 1249-1256 (2003)

[Publications] E.Saiz, C.-W.Hwang, K.Suganuma, A.P.Tomsia: "Spreading of Sn-Ag solders on Fe-Ni alloys"Acta Mater. 51・11. 3185-3197 (2003)

[Publications] K.S.KIM, M.Haga, K.Suganuma: "In-Situ Observation and Simulation of the Solidification Process in Soldering a Small Outline Package with the Sn-Ag-Cu Lead-Free Alloy"J.Electron.Mater. 32・12. 1483-1489 (2003)

[Publications] C.W.Hwang, K.Suganuma: "Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders"J.Mater.Res.. 18・11. 2540-2543 (2003)

[Publications] C.W.Hwang, K.Suganuma: "Effects of Cu Addition to Sn-Ag Lead-Free Solder on Interfacial Stability with Fe-42 Ni"Materials Transaction. 45・3. 716-722 (2004)

[Publications] C.W.Hwang, K.Suganuma: "Joint reliability and high temperature stability of Sn-Ag-Bi lead-free solder with Cu and Sn-Pb/Ni/Cu substrates"Materials Science & Engineering A. (in press). (2004)

[Publications] M.Haga, K.S.Kim, K.Suganuma: "In situ observation and simulation of solidification process in soldering SOP with Sn-Ag-Cu Lead-Free Alloy"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 261 (2003)

[Publications] C.W.Hwang, J.G.Lee, H.Mori, K.Suganuma: "Interface microstructure between 42 alloy and Sn-based lead-free solder"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 305 (2003)

[Publications] C.W.Hwang, K.S.Kim, K.Suganuma: "Interfaces in lead-free soldering (invited)"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 316 (2003)

[Publications] M.Inoue, K.Suganuma: "Analysis of surface reaction behavior for generating atomic hydrogen on Ni_3Al surfaces"132nd TMS Annual Meeting & Exhibition, San Diego, California. (Proceedings). 455 (2003)

[Publications] Y.S.Kim, C.W.Hwang, K.Suganuma: "Solderability and Interface Property of Sn-Zn-Bi on Metal Substrates"International Conference on Electronics Packaging(ICEP2003), JEEP, Tokyo. (Proceedings). 345-348 (2003)

[Publications] C.W.Hwang, K.Suganuma: "Interfacial Reaction of Sn-based Lead-free Solder with Fe-42Ni Substrate"International Conference on Electronics Packaging(ICEP2003), JIEP, Tokyo. (Proceedings). 360-365 (2003)

[Publications] K.Suganuma, T.Kiga, M.Takeuchi, et al.: "Current Technology of Low Temperature Lead-Free Soldering and JIEP Project"International Conference on Lead Free Electronics "Towards Imprementation of the RHS Directive", IPC/Soldertech, Brussels. (Proceedings). 97-104 (2003)

[Publications] K.Suganuma, C.W.Hwang, M.Kiso, S.Hashimoto: "Interfacial stability of Sn-Ag-Cu lead-free solder with Ni-P alloy plating"Interl Technology Symposium, "Sesigning for next generation Computing Platforms", San Jose. (Proceedings). 18 (2003)

[Publications] K.S.Kim, K.Suganuma, M.Ueshima: "Development of New Lead-Free Solder Containing Nano Sized Particles"2004 TMS ANNUAL MEETING, Charlotte. (program). 22 (2004)

[Publications] K.Suganuma, K.S.Kim, C.W.Hwang: "Solidification Phenomenon in CSP Soldering with Sn-Ag-Cu Lead-Free Alloy Using In Situ Observation System with Computer Simulation(invited)"2004 TMS ANNUAL MEETING, Charlotte. (program). 23 (2004)

[Publications] C.W.Hwang, K.Suganuma, M.Kiso, S.Hashimoto: "Differences in Formation and Growth of Interface Between Sn-Ag and Sn-Ag-Cu Lead-Free Solder with Ni-P/Au Plating(invited)"2004 TMS ANNUAL MEETING, Charlotte. (program). 172 (2004)

[Publications] 菅沼克昭: "欧州の環境規制と世界の実用化に向けた鉛フリーはんだの技術動向"電子材料「実装技術ガイドブック2003年」. 5月号別冊. 2-10 (2003)

[Publications] 菅沼克昭: "鉛フリー化とハロゲンフリー化の基礎知識と最新研究開発動向"電子技術「2003年版プリント配線板のすべて」. 6月号別冊. 16-21 (2003)

[Publications] 菅沼克昭: "鉛フリーはんだ実用をめぐる欧州規制と技術の現状"金属. 73. 40-51 (2003)

[Publications] 菅沼克昭: "鉛フリー化から先進実装へ進化する接着剤技術"日立化成テクニカルレポート. 41. 5-6 (2003)

[Publications] 菅沼克昭: "低温鉛フリーはんだの位置づけと市場意識"エレクトロニクス実装学会誌. 6・5. 369-374 (2003)

[Publications] K.Suganuma: "Current status of lead-free soldering"SMT China. Nov/Dec. 42-49 (2003)

[Publications] 菅沼克昭, 黄 致元: "鉛フリーはんだとNiめっき界面反応と組織"Uyemura Technical Report. 55. 3-12 (2004)

[Publications] 菅沼克昭: "鉛フリーはんだ実装技術-基礎からリフトオフ対策まで- (分担執筆)"コロナ社. 293 (2003)

[Publications] 菅沼克昭: "鉛フリーはんだ付け技術(分担執筆)"環境材料研究会編,工業調査会. 188 (2003)

[Publications] K.Suganuma: "Lead-Free Soldering in Electronics (編著)"Marcel Dekker, Inc. 376 (2003)

菅沼克昭大阪大学, 産業科学研究所, 教授 (10154444)

[Publications] 菅沼克昭, 酒井泰治, 金槿銖: "Sn-Bi共晶合金の組織及び機械的性質へ及ぼすAg添加の影響"エレクトロニクス実装学会誌. 6・5. 414-419 (2003)

[Publications] 菅沼克昭, 黄致元: "鉛フリーはんだとNiめっき界面反応と組織"Uyemura Technical Report. 55. 3-12 (2004)