2004 Fiscal Year Final Research Report Summary
Active Printed Circuit Boards/Three-Dimensional Micro Optical Switching Systems and Resource-Saving Device Integration Processes
| Project/Area Number |
14550041
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Applied optics/Quantum optical engineering
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| Research Institution | Tokyo University of Technology |
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Principal Investigator |
YOSHIMURA Tetsuzo Tokyo University of Technology, Department of Electronics, Professor, バイオニクス学部, 教授 (50339769)
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| Co-Investigator(Kenkyū-buntansha) |
KUROKAWA Hiroaki Tokyo University of Technology, Department of Electronics, Lecturer, バイオニクス学部, 講師 (20308282)
ASAMA Kunihiko Tokyo University of Technology, Department of Electronics, Professor, バイオニクス学部, 教授 (10277882)
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| Project Period (FY) |
2002 – 2004
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| Keywords | optical interconnects / three-dimensional micro-optical network / optical printed circuit boards / optical switching systems / film stacking / device embedding / self-organized lightwave network(SOLNET) / resource-saving device integration processes |
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| Research Abstract |
In order to reduce size/cost of optical interconnects within boxes, we proposed "Three-Dimensional(3-D) Stacked Optoelectronic(OE) System LSI" and "3-D Micro Optical Switching System (3D-MOSS)" based on the following strategies : constructing 3-D architecture, embedding thin-film devices into waveguide films, and forming self-organized inter-film optical wiring. We obtained results described below.
1.3D-MOSS can achieve 1024x1024 optical switching with a system size of-1.4x0.6 cm^2 and insertion loss of 29 dB, which correspond to an occupation area reduction of 3/100 and loss reduction of 14 dB comparing with the conventional planar structure.
2.A resource-saving device integration process "Photolithographic Packaging with Selectively-Occupied Repeated Transfer (PL-Pack with SORT)," which integrates different types of active elements into one substrate in desired distributions using all-photolithographic process, was found to be able to decrease consumption of embedded functional materials down to 1/10〜1/10000, resulting in drastic cost reduction. The proof-of-concept of the process was demonstrated experimentally.
3.Waveguide films with surface-normal mirrors were fabricated by the built-in mask method. The method will realize cost-effective mass production of waveguide films with fine-pitch micro mirrors of arbitrary directions with maximized positional accuracy and with minimized processing cost. The proof-of-concept of the process was demonstrated experimentally.
4.To reduce fabrication cost of optical Z-connections, we proposed to apply Self-Organized Lightwave Network(SOLNET) to the vertical waveguide formation. The beam propagation method reveals that, while 25% waveguide misalignment in film assembly raises the insertion loss up to 73 dB in 3D-MOSS, SOLNET can reduce it down to 31 dB. Experimental works demonstrated high coupling efficiencies of SOLNET with wide tolerance, indicating that SOLNET is effective for 3-D optical wiring construction.
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